Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362343 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2025-07-15 |
| 12237239 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ji Young Chung, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee +1 more | 2025-02-25 |
| 12230661 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2025-02-18 |
| 12107035 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Dong Joo Park, Byong Woo Cho +4 more | 2024-10-01 |
| 11961867 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2024-04-16 |
| 11430723 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Dong Joo Park, Byong Woo Cho +4 more | 2022-08-30 |
| 11362128 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2022-06-14 |
| 11205602 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ji Young Chung, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee +1 more | 2021-12-21 |
| 11183493 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2021-11-23 |
| 10692918 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2020-06-23 |
| 10388643 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2019-08-20 |
| 10304890 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2019-05-28 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ji Young Chung, Byong Jin Kim, Gi Jeong Kim, Choon Heung Lee | 2019-01-08 |
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Dong Joo Park, Byong Woo Cho +4 more | 2018-10-02 |
| 10062626 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ji Young Chung, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee +1 more | 2018-08-28 |
| 9831282 | Electronic device package and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2017-11-28 |
| 9633966 | Stacked semiconductor package and manufacturing method thereof | Dong Joo Park, Jae Sung Park, Jin Seong Kim | 2017-04-25 |
| 9627348 | Laser assisted bonding for semiconductor die interconnections | Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Chan Ha Hwang +1 more | 2017-04-18 |
| 9627368 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Doo Hyun Park, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2017-04-18 |
| 9431447 | Package of finger print sensor and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2016-08-30 |
| 9129873 | Package of finger print sensor and fabricating method thereof | Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha +1 more | 2015-09-08 |
| 8847372 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2014-09-30 |
| 8541260 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2013-09-24 |
| 8476748 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2013-07-02 |
| 8368194 | Exposed die overmolded flip chip package | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2013-02-05 |