Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9627348 | Laser assisted bonding for semiconductor die interconnections | Dong Su Ryu, Choon Heung Lee, Min Ho Kim, Choong Hoe Kim, Ju Hoon Yoon +1 more | 2017-04-18 |
| 9513254 | Microfluidic sensor package structure and method | Hyung-II Jeon, Ji Young Chung, Byong Jin Kim, Yung Woo Lee, Do Hyun Na +1 more | 2016-12-06 |
| 8487420 | Package in package semiconductor device with film over wire | Eun Sook Sohn, Ho Choi, Byong Jin Kim, Ji-Yeon YU, Min-Woo Lee | 2013-07-16 |
| 8198738 | Structure of bond pad for semiconductor die and method therefor | Do Hyun Na, Chang Deok Lee | 2012-06-12 |
| 8026589 | Reduced profile stackable semiconductor package | Bong Chan Kim, Do Hyung Kim, Min-Woo Lee, Eun Sook Sohn, Won Joon Kang | 2011-09-27 |