Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431611 | Semiconductor devices and methods of manufacturing semiconductor devices | Corey Reichman, Kyoung Yeon Lee, Se Man Oh | 2025-09-30 |
| 12424524 | Semiconductor devices and methods of manufacturing semiconductor devices | Shaun Bowers, Yoshio Matsuda, Hyung Il Jeon, Gi Jeong Kim, Jae Min Bae +2 more | 2025-09-23 |
| 12334420 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Gi Jeong Kim, Yong Ho Son, Jae Min Bae, Seung Woo Lee | 2025-06-17 |
| 12261145 | Semiconductor device and methods of manufacturing semiconductor devices | Ji Yeon Ryu, Jae Beom Shim, Tai Yong LEE | 2025-03-25 |
| 12062833 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Gi Jeong Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2024-08-13 |
| 12062588 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2024-08-13 |
| 12057378 | Semiconductor devices and methods of manufacturing semiconductor devices | Gi Jeong Kim, Hyeong Il Jeon, Junichiro Abe | 2024-08-06 |
| 12046798 | Semiconductor devices and methods of manufacturing semiconductor devices | Corey Reichman, Kyoung Yeon Lee, Se Man Oh | 2024-07-23 |
| 12009289 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi +5 more | 2024-06-11 |
| 11961794 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Gi Jeong Kim, Ji Young Chung | 2024-04-16 |
| 11908779 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2024-02-20 |
| 11887916 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Gi Jeong Kim, Yong Ho Son, Jae Min Bae, Seung Woo Lee | 2024-01-30 |
| 11855000 | Semiconductor device having EMI shielding structure and related methods | Young Woo Lee, Jae Ung Lee, EunNaRa Cho, Ji Hoon Oh, Young Seok Kim +4 more | 2023-12-26 |
| 11677135 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Gi Jeong Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2023-06-13 |
| 11569163 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Won Bae Bang, Sang Goo Kang | 2023-01-31 |
| 11508635 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2022-11-22 |
| 11355470 | Semiconductor device and methods of manufacturing semiconductor devices | Ji Yeon Ryu, Jae Beom Shim, Tae Yong Lee | 2022-06-07 |
| 11355449 | Semiconductor device having EMI shielding structure and related methods | Young Woo Lee, Jae Ung Lee, EunNaRa Cho, Ji Hoon Oh, Young Seok Kim +4 more | 2022-06-07 |
| 11152296 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi +5 more | 2021-10-19 |
| 11145588 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Won Bae Bang, Sang Goo Kang | 2021-10-12 |
| 11018079 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2021-05-25 |
| 10910298 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Gi Jeong Kim, Ji Young Chung | 2021-02-02 |
| 10685897 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2020-06-16 |
| 10468343 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Won Bae Bang, Sang Goo Kang | 2019-11-05 |
| 10366943 | Packaged electronic device having stepped conductive structure and related methods | Jia Yunn Ting, Hyeong Il Jeon | 2019-07-30 |