Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424524 | Semiconductor devices and methods of manufacturing semiconductor devices | Shaun Bowers, Yoshio Matsuda, Hyung Il Jeon, Byong Jin Kim, Gi Jeong Kim +2 more | 2025-09-23 |
| 12334420 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Gi Jeong Kim, Yong Ho Son, Byong Jin Kim, Seung Woo Lee | 2025-06-17 |
| 12300584 | Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereof | Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee | 2025-05-13 |
| 12237239 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim +1 more | 2025-02-25 |
| 12087676 | Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof | Hyung Jun Cho, Seung Woo Lee | 2024-09-10 |
| 12062833 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Seung-Mo Kim +1 more | 2024-08-13 |
| 11915998 | Semiconductor device and a method of manufacturing a semiconductor device | Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee | 2024-02-27 |
| 11908779 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2024-02-20 |
| 11887916 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Gi Jeong Kim, Yong Ho Son, Byong Jin Kim, Seung Woo Lee | 2024-01-30 |
| 11694946 | Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof | Hyung Jun Cho, Seung Woo Lee | 2023-07-04 |
| 11677135 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Seung-Mo Kim +1 more | 2023-06-13 |
| 11521918 | Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof | Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee | 2022-12-06 |
| 11417589 | Semiconductor device and a method of manufacturing a semiconductor device | Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee | 2022-08-16 |
| 11205602 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim +1 more | 2021-12-21 |
| 11018079 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2021-05-25 |
| 10840169 | Semiconductor device and a method of manufacturing a semiconductor device | Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee | 2020-11-17 |
| 10062626 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ji Young Chung, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim +1 more | 2018-08-28 |
| 9978695 | Semiconductor device including leadframe with a combination of leads and lands and method | Byong Jin Kim, Won Bae Bang | 2018-05-22 |
| 9966652 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Seung-Mo Kim +1 more | 2018-05-08 |
| 9911685 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2018-03-06 |
| 9631481 | Semiconductor device including leadframe with a combination of leads and lands and method | Byong Jin Kim, Won Bae Bang | 2017-04-25 |
| 9543235 | Semiconductor package and method therefor | Hyung Il Jeon, Ji Young Chung, Byong Jin Kim, In Bae Park, No Sun Park | 2017-01-10 |
| 9508631 | Semiconductor device including leadframe with a combination of leads and lands and method | Byong Jin Kim, Won Bae Bang | 2016-11-29 |
| 9431334 | Semiconductor device having single layer substrate and method | Hyung Il Jeon, Byong Jin Kim, Gi Jeong Kim, Tae Ki Kim | 2016-08-30 |
| 9293398 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2016-03-22 |