Issued Patents All Time
Showing 25 most recent of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062588 | Semiconductor package having routable encapsulated conductive substrate and method | Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2024-08-13 |
| 11961794 | Method of forming a molded substrate electronic package and structure | Byong Jin Kim, Gi Jeong Kim, Ji Young Chung | 2024-04-16 |
| 11961775 | Semiconductor devices and related methods | Gyu Wan Han, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim +10 more | 2024-04-16 |
| 11923280 | Semiconductor device and manufacturing method thereof | Kwang Seok Oh | 2024-03-05 |
| 11646248 | Semiconductor device having a lead flank and method of manufacturing a semiconductor device having a lead flank | Kwang Seok Oh, George Scott | 2023-05-09 |
| 11569163 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2023-01-31 |
| 11508635 | Semiconductor package having routable encapsulated conductive substrate and method | Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2022-11-22 |
| 11495505 | Semiconductor devices and related methods | Gyu Wan Han, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim +10 more | 2022-11-08 |
| 11398455 | Semiconductor devices and related methods | Gyu Wan Han, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim +8 more | 2022-07-26 |
| 11145588 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2021-10-12 |
| 11114369 | Semiconductor device and manufacturing method thereof | Kwang Seok Oh | 2021-09-07 |
| 10910298 | Method of forming a molded substrate electronic package and structure | Byong Jin Kim, Gi Jeong Kim, Ji Young Chung | 2021-02-02 |
| 10685897 | Semiconductor package having routable encapsulated conductive substrate and method | Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2020-06-16 |
| 10468343 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2019-11-05 |
| 10340213 | Semiconductor device and manufacturing method thereof | Kwang Seok Oh | 2019-07-02 |
| 10224218 | Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure | Byong Jin Kim, Gi Jeong Kim, Ji Young Chung | 2019-03-05 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Ju Hoon Yoon, Ji Young Chung, Byong Jin Kim, Gi Jeong Kim, Choon Heung Lee | 2019-01-08 |
| 10049954 | Semiconductor package having routable encapsulated conductive substrate and method | Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2018-08-14 |
| 9978695 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Byong Jin Kim | 2018-05-22 |
| 9922919 | Electronic package structure having insulated substrate with lands and conductive patterns | Byong Jin Kim, Gi Jeong Kim, Ji Young Chung | 2018-03-20 |
| 9881864 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2018-01-30 |
| 9631481 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Byong Jin Kim | 2017-04-25 |
| 9613829 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Byong Jin Kim, Sang Goo Kang | 2017-04-04 |
| 9552999 | Packaged electronic device having reduced parasitic effects and method | Tae Ki Kim, Byong Jin Kim, Ji Young Chung, Gi Jeong Kim | 2017-01-24 |
| 9508631 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Byong Jin Kim | 2016-11-29 |