| 12062588 |
Semiconductor package having routable encapsulated conductive substrate and method |
Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon |
2024-08-13 |
$39,825,000 |
| 11961794 |
Method of forming a molded substrate electronic package and structure |
Byong Jin Kim, Gi Jeong Kim, Ji Young Chung |
2024-04-16 |
|
| 11961775 |
Semiconductor devices and related methods |
Gyu Wan Han, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim +10 more |
2024-04-16 |
$15,267,000 |
| 11923280 |
Semiconductor device and manufacturing method thereof |
Kwang Seok Oh |
2024-03-05 |
$75,929,000 |
| 11646248 |
Semiconductor device having a lead flank and method of manufacturing a semiconductor device having a lead flank |
Kwang Seok Oh, George Scott |
2023-05-09 |
$21,639,000 |
| 11569163 |
Method for fabricating semiconductor package and semiconductor package using the same |
Seung Woo Lee, Byong Jin Kim, Sang Goo Kang |
2023-01-31 |
$33,226,000 |
| 11508635 |
Semiconductor package having routable encapsulated conductive substrate and method |
Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon |
2022-11-22 |
$21,036,000 |
| 11495505 |
Semiconductor devices and related methods |
Gyu Wan Han, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim +10 more |
2022-11-08 |
$53,386,000 |
| 11398455 |
Semiconductor devices and related methods |
Gyu Wan Han, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim +8 more |
2022-07-26 |
$44,941,000 |
| 11145588 |
Method for fabricating semiconductor package and semiconductor package using the same |
Seung Woo Lee, Byong Jin Kim, Sang Goo Kang |
2021-10-12 |
$29,684,000 |
| 11114369 |
Semiconductor device and manufacturing method thereof |
Kwang Seok Oh |
2021-09-07 |
$76,713,000 |
| 10910298 |
Method of forming a molded substrate electronic package and structure |
Byong Jin Kim, Gi Jeong Kim, Ji Young Chung |
2021-02-02 |
$26,749,000 |
| 10685897 |
Semiconductor package having routable encapsulated conductive substrate and method |
Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon |
2020-06-16 |
$44,416,000 |
| 10468343 |
Method for fabricating semiconductor package and semiconductor package using the same |
Seung Woo Lee, Byong Jin Kim, Sang Goo Kang |
2019-11-05 |
|
| 10340213 |
Semiconductor device and manufacturing method thereof |
Kwang Seok Oh |
2019-07-02 |
$7,631,000 |
| 10224218 |
Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure |
Byong Jin Kim, Gi Jeong Kim, Ji Young Chung |
2019-03-05 |
$4,445,000 |
| 10177117 |
Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure |
Ju Hoon Yoon, Ji Young Chung, Byong Jin Kim, Gi Jeong Kim, Choon Heung Lee |
2019-01-08 |
$7,550,000 |
| 10049954 |
Semiconductor package having routable encapsulated conductive substrate and method |
Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon |
2018-08-14 |
$14,353,000 |
| 9978695 |
Semiconductor device including leadframe with a combination of leads and lands and method |
Jae Min Bae, Byong Jin Kim |
2018-05-22 |
$8,107,000 |
| 9922919 |
Electronic package structure having insulated substrate with lands and conductive patterns |
Byong Jin Kim, Gi Jeong Kim, Ji Young Chung |
2018-03-20 |
$20,211,000 |
| 9881864 |
Method for fabricating semiconductor package and semiconductor package using the same |
Seung Woo Lee, Byong Jin Kim, Sang Goo Kang |
2018-01-30 |
$18,834,000 |
| 9631481 |
Semiconductor device including leadframe with a combination of leads and lands and method |
Jae Min Bae, Byong Jin Kim |
2017-04-25 |
$6,439,000 |
| 9613829 |
Method for fabricating semiconductor package and semiconductor package using the same |
Seung Woo Lee, Byong Jin Kim, Sang Goo Kang |
2017-04-04 |
$23,786,000 |
| 9552999 |
Packaged electronic device having reduced parasitic effects and method |
Tae Ki Kim, Byong Jin Kim, Ji Young Chung, Gi Jeong Kim |
2017-01-24 |
$11,797,000 |
| 9508631 |
Semiconductor device including leadframe with a combination of leads and lands and method |
Jae Min Bae, Byong Jin Kim |
2016-11-29 |
$12,744,000 |
