Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12356777 | Semiconductor devices and methods of manufacturing semiconductor devices | Ki Dong Sim, Jin Young Khim | 2025-07-08 |
| 12107035 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Byong Woo Cho +4 more | 2024-10-01 |
| 12002725 | Sensor package and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2024-06-04 |
| 11996369 | Semiconductor devices and methods of manufacturing semiconductor devices | Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Ji Hun Yi, Jin Young Khim | 2024-05-28 |
| 11961775 | Semiconductor devices and related methods | Gyu Wan Han, Won Bae Bang, Ju-Hyung Lee, Min Hwa Chang, Jin Young Khim +10 more | 2024-04-16 |
| 11869829 | Semiconductor device with through-mold via | Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim +3 more | 2024-01-09 |
| 11788691 | Hidden lighting lamp using color conversion materials and vehicles having same | Seung-Pyo Hong, Yun Min Cho, Ju Hyun Kim, Chang-Hwan Oh, Jung Woo Shin +1 more | 2023-10-17 |
| 11746981 | Multi-faceted reflective hidden lighting lamp and vehicle thereof | Seung-Pyo Hong, Yun Min Cho, Chang-Hwan Oh, Han Soo Park, Ju Hyun Kim +1 more | 2023-09-05 |
| 11682598 | Sensor package and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2023-06-20 |
| 11545604 | Semiconductor devices and methods of manufacturing semiconductor devices | Ki Dong Sim, Jin Young Khim | 2023-01-03 |
| 11495505 | Semiconductor devices and related methods | Gyu Wan Han, Won Bae Bang, Ju-Hyung Lee, Min Hwa Chang, Jin Young Khim +10 more | 2022-11-08 |
| 11482496 | Semiconductor devices and methods of manufacturing semiconductor devices | Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Ji Hun Yi, Jin Young Khim | 2022-10-25 |
| 11430723 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Byong Woo Cho +4 more | 2022-08-30 |
| 11398455 | Semiconductor devices and related methods | Gyu Wan Han, Won Bae Bang, Ju-Hyung Lee, Min Hwa Chang, Jin Young Khim +8 more | 2022-07-26 |
| 11177187 | Sensor package and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2021-11-16 |
| 10811341 | Semiconductor device with through-mold via | Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim +3 more | 2020-10-20 |
| 10672676 | Sensor package and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2020-06-02 |
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Byong Woo Cho +4 more | 2018-10-02 |
| 9984947 | Fingerprint sensor and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2018-05-29 |
| 9837331 | Semiconductor device having overlapped via apertures | Jin Seong Kim, Kwang Ho Kim, Hee Yeoul Yoo, Jeong Wung Jeong | 2017-12-05 |
| 9728476 | Fingerprint sensor and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2017-08-08 |
| 9633966 | Stacked semiconductor package and manufacturing method thereof | Jae Sung Park, Jin Seong Kim, Ju Hoon Yoon | 2017-04-25 |
| 9185713 | Apparatus and method for transmitting and receiving a RACH signal in SC-FDMA system | Sung Lark Kwon, Hyuck Chan Kwon, Young Kwon Ryu, Hoo Young Jeong, Hong Jik Kim +4 more | 2015-11-10 |
| 9177932 | Semiconductor device having overlapped via apertures | Jin Seong Kim, Kwang Ho Kim, Hee Yeoul Yoo, Jeong Wung Jeong | 2015-11-03 |
| 8557629 | Semiconductor device having overlapped via apertures | Jin Seong Kim, Kwang Ho Kim, Hee Yeoul Yoo, Jeong Wung Jeong | 2013-10-15 |