Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288764 | Semiconductor device and manufacturing method thereof | Gyu Wan Han, Jin Seong Kim | 2025-04-29 |
| 12107035 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2024-10-01 |
| 11430723 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2022-08-30 |
| 11049828 | Electronic device with interconnection structure oblate ellipsoid-shaped aperture | Gyu Wan Han, Jin Seong Kim | 2021-06-29 |
| 11031356 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Cha Gyu Song | 2021-06-08 |
| 10504857 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Cha Gyu Song | 2019-12-10 |
| 10090230 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2018-10-02 |
| 9917063 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Cha Gyu Song | 2018-03-13 |
| 8575742 | Semiconductor device with increased I/O leadframe including power bars | Wan-Jong Kim, Young Tak Do | 2013-11-05 |