Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031356 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Byong Woo Cho | 2021-06-08 |
| 10504857 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Byong Woo Cho | 2019-12-10 |
| 10297552 | Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects | Jin Seong Kim, Ye Sul Ahn | 2019-05-21 |
| 9917063 | Semiconductor package structure for improving die warpage and manufacturing method thereof | Jin Seong Kim, Byong Woo Cho | 2018-03-13 |
| 9502392 | Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects | Jin Seong Kim, Ye Sul Ahn | 2016-11-22 |