| 12388005 |
Semiconductor package and fabricating method thereof |
Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Chel Woo Park |
2025-08-12 |
| 11961797 |
Semiconductor package and fabricating method thereof |
Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Chel Woo Park |
2024-04-16 |
| 11869829 |
Semiconductor device with through-mold via |
Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Ho Choi, Kwang Ho Kim +3 more |
2024-01-09 |
| 11121071 |
Semiconductor package and fabricating method thereof |
Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Chel Woo Park |
2021-09-14 |
| 10811341 |
Semiconductor device with through-mold via |
Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Ho Choi, Kwang Ho Kim +3 more |
2020-10-20 |
| 10586761 |
Semiconductor package and fabricating method thereof |
Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Chel Woo Park |
2020-03-10 |
| 10242956 |
Semiconductor device with metal dam and fabricating method |
Dong Hee Lee, Min Yoo, Bae Yong Kim |
2019-03-26 |
| 10037949 |
Semiconductor package and fabricating method thereof |
Hee Sung Kim, Yeoung Beom Ko, Jae Jin Lee, Joon Dong Kim, Dong Jean Kim |
2018-07-31 |
| 9859203 |
Semiconductor package and fabricating method thereof |
Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Chel Woo Park |
2018-01-02 |
| 8890329 |
Semiconductor device |
Do Hyung Kim, Seung Chul Han |
2014-11-18 |
| 8441123 |
Semiconductor device with metal dam and fabricating method |
Dong Hee Lee, Min Yoo, Bae Yong Kim |
2013-05-14 |
| 8089145 |
Semiconductor device including increased capacity leadframe |
Gwang Kim, Jin Seong Kim, Dong Joo Park |
2012-01-03 |
| 7982298 |
Package in package semiconductor device |
Sung Jin Yang, Jung Tae Ok, Jae Dong Kim |
2011-07-19 |
| 6897550 |
Fully-molded leadframe stand-off feature |
Curtis Zwenger, Raul Guerrero, Chul-Woo Park |
2005-05-24 |