Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147851 | Semiconductor light emitting device package | Hak Hwan Kim | 2018-12-04 |
| 9871172 | Semiconductor light emitting device package with wavelength conversion layer | Hak Hwan Kim | 2018-01-16 |
| 9728686 | Method of fabricating white LED devices | Min Jung Kim, Jeong Hee Kim | 2017-08-08 |
| 9269620 | Method of manufacturing bump | Hak Hwan Kim, Ho Sun Paek, Kwon Kim | 2016-02-23 |
| 7982298 | Package in package semiconductor device | Dae Byoung Kang, Sung Jin Yang, Jae Dong Kim | 2011-07-19 |