DR

Dong Soo Ryu

AT Amkor Technology: 5 patents #128 of 595Top 25%
AP Amkor Technology Singapore Holding Pte.: 5 patents #63 of 289Top 25%
Overall (All Time): #484,815 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12388005 Semiconductor package and fabricating method thereof Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park 2025-08-12
12374558 Laser-assisted bonding apparatus for bonding an electronic device to a substrate Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Choong Hoe Kim 2025-07-29
11961797 Semiconductor package and fabricating method thereof Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park 2024-04-16
11742216 System and method for laser assisted bonding of an electronic device Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Choong Hoe Kim 2023-08-29
11121071 Semiconductor package and fabricating method thereof Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park 2021-09-14
10763129 System and method for laser assisted bonding of an electronic device Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Choong Hoe Kim 2020-09-01
10586761 Semiconductor package and fabricating method thereof Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park 2020-03-10
10304698 System and method for laser assisted bonding of semiconductor die Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Choong Hoe Kim 2019-05-28
9916989 System and method for laser assisted bonding of semiconductor die Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Choong Hoe Kim 2018-03-13
9859203 Semiconductor package and fabricating method thereof Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park 2018-01-02