Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388005 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park | 2025-08-12 |
| 11961797 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park | 2024-04-16 |
| 11450644 | Semiconductor package having a reinforcement layer | Sung Su Kim | 2022-09-20 |
| 11121071 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park | 2021-09-14 |
| 10586761 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park | 2020-03-10 |
| 9859203 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park | 2018-01-02 |