Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374576 | Semiconductor manufacturing apparatus and manufacturing method for semiconductor device | Tsuyoshi Yokomori, Yuki NAKUI, Hiroshi Maki, Akira Saito, Naoki Okamoto | 2025-07-29 |
| 11569118 | Semiconductor manufacturing apparatus and manufacturing method for semiconductor device | Tsuyoshi Yokomori, Yuki NAKUI, Hiroshi Maki, Akira Saito, Naoki Okamoto | 2023-01-31 |
| 8703583 | Fabrication method of semiconductor device | Hiroshi Maki, Masayuki Mochizuki, Ryuichi Takano, Yoshiaki Makita, Haruhiko Fukasawa +1 more | 2014-04-22 |
| 8492173 | Manufacturing method for semiconductor integrated device | Hiroshi Maki, Tsuyoshi Yokomori | 2013-07-23 |
| 8460491 | Die bonder and bonding method | Shingo Fukasawa, Yoshihiro Kurihara | 2013-06-11 |
| 8372665 | Manufacturing method for semiconductor integrated device | Hiroshi Maki, Tsuyoshi Yokomori | 2013-02-12 |
| 8222050 | Manufacturing method for semiconductor integrated device | Hiroshi Maki, Tsuyoshi Yokomori | 2012-07-17 |
| 8003495 | Manufacturing method for semiconductor integrated device | Hiroshi Maki, Tsuyoshi Yokomori | 2011-08-23 |
| 7888141 | Manufacturing method for semiconductor integrated device | Hiroshi Maki, Tsuyoshi Yokomori | 2011-02-15 |
| 7629231 | Fabrication method of semiconductor device | Hiroshi Maki, Masayuki Mochizuki, Ryuichi Takano, Yoshiaki Makita, Haruhiko Fukasawa +1 more | 2009-12-08 |