Issued Patents All Time
Showing 25 most recent of 52 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374576 | Semiconductor manufacturing apparatus and manufacturing method for semiconductor device | Tsuyoshi Yokomori, Tatsuyuki Okubo, Yuki NAKUI, Akira Saito, Naoki Okamoto | 2025-07-29 |
| 11569118 | Semiconductor manufacturing apparatus and manufacturing method for semiconductor device | Tsuyoshi Yokomori, Tatsuyuki Okubo, Yuki NAKUI, Akira Saito, Naoki Okamoto | 2023-01-31 |
| 11059401 | Seat back | Genzo Nakamura, Toshio Nakamura, Katsuya Ueda, Yasuhiro Yoshida, Kentaro Kamiya | 2021-07-13 |
| 11040645 | Seat back | Genzo Nakamura, Toshio Nakamura, Katsuya Ueda, Yasuhiro Yoshida, Kentaro Kamiya | 2021-06-22 |
| 10158087 | Organic thin film, and organic semiconductor device and organic transistor using same | Junichi Hanna, Hiroaki Iino, Yasuyuki Watanabe, Junichiro Koike, Yutaka Tachikawa +2 more | 2018-12-18 |
| 10096526 | Die bonder and bonding method | Masayuki Mochizuki, Yukio Tani, Takehito Mochizuki | 2018-10-09 |
| 9951275 | Liquid Crystal Display Device | Shinji Ogawa, Yoshinori Iwashita, Junichiro Koike, Masami Shishikura, Ryosuke Asami | 2018-04-24 |
| 9810938 | Liquid crystal display device | Takeshi Kuriyama, Jouji Kawamura, Junichiro Koike, Masami Shishikura, Ryosuke Asami | 2017-11-07 |
| 9464231 | Liquid crystal display device | Shinji Ogawa, Yoshinori Iwashita, Junichiro Koike, Masami Shishikura, Ryosuke Asami | 2016-10-11 |
| 9436032 | Liquid crystal display device | Takeshi Kuriyama, Jouji Kawamura, Junichiro Koike, Masami Shishikura, Ryosuke Asami | 2016-09-06 |
| 9318361 | Collet cleaning method and die bonder using the same | Yoshihide Ishii | 2016-04-19 |
| 8991681 | Die bonder and bonding method | Masayuki Mochizuki, Yukio Tani, Takehito Mochizuki | 2015-03-31 |
| 8783319 | Foreign substance removing device and die bonder equipped with the same | Takashi Yamagami, Ryuichi Takano, Masayuki Mochizuki | 2014-07-22 |
| 8727202 | Die bonder and bonding method | Nobuhisa Nakajima, Fukashi Tanaka | 2014-05-20 |
| 8703583 | Fabrication method of semiconductor device | Masayuki Mochizuki, Ryuichi Takano, Yoshiaki Makita, Haruhiko Fukasawa, Keisuke Nadamoto +1 more | 2014-04-22 |
| 8640943 | Fabrication method of semiconductor integrated circuit device | Yukio Tani | 2014-02-04 |
| 8593261 | Tool management method of die bonder and die bonder | Susumu Takagi | 2013-11-26 |
| 8574933 | Fabrication method of semiconductor device | Hideharu Kobashi, Masayuki Mochizuki, Yoshiaki Makita | 2013-11-05 |
| 8561664 | Die bonder, pickup method, and pickup device | Naoki Okamoto | 2013-10-22 |
| 8492173 | Manufacturing method for semiconductor integrated device | Tsuyoshi Yokomori, Tatsuyuki Okubo | 2013-07-23 |
| 8450150 | Manufacturing method of semiconductor integrated circuit device | Makoto Ise | 2013-05-28 |
| 8372665 | Manufacturing method for semiconductor integrated device | Tsuyoshi Yokomori, Tatsuyuki Okubo | 2013-02-12 |
| 8367433 | Fabrication method of semiconductor device | Hideharu Kobashi, Masayuki Mochizuki, Yoshiaki Makita | 2013-02-05 |
| 8292159 | Fabrication method of semiconductor integrated circuit device | Yukio Tani | 2012-10-23 |
| 8222050 | Manufacturing method for semiconductor integrated device | Tsuyoshi Yokomori, Tatsuyuki Okubo | 2012-07-17 |