Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9099524 | Die bonder | Shingo Fukasawa | 2015-08-04 |
| 8703583 | Fabrication method of semiconductor device | Hiroshi Maki, Masayuki Mochizuki, Ryuichi Takano, Haruhiko Fukasawa, Keisuke Nadamoto +1 more | 2014-04-22 |
| 8574933 | Fabrication method of semiconductor device | Hideharu Kobashi, Hiroshi Maki, Masayuki Mochizuki | 2013-11-05 |
| 8367433 | Fabrication method of semiconductor device | Hideharu Kobashi, Hiroshi Maki, Masayuki Mochizuki | 2013-02-05 |
| 7824932 | Fabrication method of semiconductor device | Hideharu Kobashi, Hiroshi Maki, Masayuki Mochizuki | 2010-11-02 |
| 7629231 | Fabrication method of semiconductor device | Hiroshi Maki, Masayuki Mochizuki, Ryuichi Takano, Haruhiko Fukasawa, Keisuke Nadamoto +1 more | 2009-12-08 |
| 7153052 | Writing implement | Kyo Nakayama | 2006-12-26 |