Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327739 | Die bonding apparatus and manufacturing method for semiconductor apparatus | Masayuki Mochizuki | 2025-06-10 |
| 11692947 | Die bonding apparatus and manufacturing method for semiconductor device | Yuta Ono, Koji Hosaka, Masaaki Yoshiyama | 2023-07-04 |
| 8574933 | Fabrication method of semiconductor device | Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita | 2013-11-05 |
| 8367433 | Fabrication method of semiconductor device | Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita | 2013-02-05 |
| 7824932 | Fabrication method of semiconductor device | Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita | 2010-11-02 |