Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12365783 | Compound, molded article, and cured product | Hidetoshi Inoue, Yoshinori Endo | 2025-07-22 |
| 12303785 | Non-transitory computer readable medium, information processing method, game device, and information processing system for party creation | Riku Takemura, Kentaro Sato, Shinichi Miura | 2025-05-20 |
| 11692947 | Die bonding apparatus and manufacturing method for semiconductor device | Hideharu Kobashi, Koji Hosaka, Masaaki Yoshiyama | 2023-07-04 |
| 9796828 | Epoxy resin composition and electronic component device | Mitsuaki Fusumada, Hironori Kobayashi, Yuya Kitagawa, Teruyoshi HASEGAWA | 2017-10-24 |