Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10301509 | Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape | Yuki Sugo, Nao Kamakura, Tsuyoshi Ishizaka | 2019-05-28 |
| 9796828 | Epoxy resin composition and electronic component device | Yuta Ono, Hironori Kobayashi, Yuya Kitagawa, Teruyoshi HASEGAWA | 2017-10-24 |
| 8729715 | Epoxy resin composition for semiconductor encapsulation | Tomohito IWASHIGE, Tomoaki Ichikawa, Naoya Sugimoto | 2014-05-20 |
| 8298872 | Manufacturing method for semiconductor device | Takashi Oda, Eiji Toyoda | 2012-10-30 |
| 6916538 | Thermosetting resin composition and semiconductor device obtained with the same | Hiroshi Noro | 2005-07-12 |
| 6617046 | Thermosetting resin composition and semiconductor device using the same | Hiroshi Noro | 2003-09-09 |