Issued Patents All Time
Showing 1–25 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837377 | Electrically conductive composition and biosensor | Naoya Sugimoto, Ryoma Yoshioka | 2023-12-05 |
| 11576819 | Laminate patchable to living body | Naoya Sugimoto, Ryoma Yoshioka | 2023-02-14 |
| 11510623 | Patchable biosensor | Shigeyasu Mori, Ryoma Yoshioka, Keiji Takemura | 2022-11-29 |
| 11217360 | Electrically conductive composition and biosensor | Naoya Sugimoto, Ryoma Yoshioka | 2022-01-04 |
| 11090405 | Laminate patchable to living body | Ryoma Yoshioka, Naoya Sugimoto, Yu TACHIKAWA | 2021-08-17 |
| 11006530 | Producing method of wired circuit board | Keisuke OKUMURA, Shotaro Masuda | 2021-05-11 |
| 10297470 | Resin sheet for sealing electronic device and method for manufacturing electronic-device package | Yusaku Shimizu, Goji Shiga | 2019-05-21 |
| 10194861 | Wired circuit board | Keisuke OKUMURA, Shotaro Masuda | 2019-02-05 |
| 9659883 | Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package | Kosuke Morita, Tsuyoshi Ishizaka, Goji Shiga, Chie Iino, Jun Ishii | 2017-05-23 |
| 9466994 | Mobile terminal power receiving module utilizing wireless power transmission and mobile terminal rechargeable battery including mobile terminal power receiving module | Hiroshi Yamazaki, Kojiro Kameyama, Hajime Sunahara | 2016-10-11 |
| 9147625 | Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device | Yusaku Shimizu, Takeshi Matsumura, Tsuyoshi Torinari, Daisuke Uenda | 2015-09-29 |
| 9131829 | Label sheet for cleaning and conveying member having cleaning function | Makoto Namikawa, Yoshio Terada, Jirou Nukaga | 2015-09-15 |
| 8999864 | Silicon wafer and method for heat-treating silicon wafer | Takeshi Senda, Hiromichi Isogai, Koji Araki, Tatsuhiko Aoki, Haruo Sudo +4 more | 2015-04-07 |
| 8938878 | Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation | Shigetomi Kido | 2015-01-27 |
| 8922031 | Thermosetting encapsulation adhesive sheet | Hiroshi Noro | 2014-12-30 |
| 8912669 | Sealing resin sheet, method for producing electronic component package and electronic component package | Yusaku Shimizu | 2014-12-16 |
| 8906746 | Method for producing semiconductor device | Takashi Oda, Kosuke Morita | 2014-12-09 |
| 8580619 | Method for producing semiconductor device | Takashi Oda, Kosuke Morita | 2013-11-12 |
| 8476149 | Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling process | Hiromichi Isogai, Takeshi Senda, Kumiko Murayama, Koji Izunome, Susumu Maeda +7 more | 2013-07-02 |
| 8399341 | Method for heat treating a silicon wafer | Takeshi Senda, Hiromichi Isogai, Kumiko Murayama, Koji Araki, Tatsuhiko Aoki +4 more | 2013-03-19 |
| 8389347 | Field effect transistor and method for manufacturing the same | Tsutomu Tezuka | 2013-03-05 |
| 8304817 | Field effect transistor and method for manufacturing the same | Tsutomu Tezuka | 2012-11-06 |
| 8298872 | Manufacturing method for semiconductor device | Takashi Oda, Mitsuaki Fusumada | 2012-10-30 |
| 8269213 | Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same | Hiroshi Noro, Naohide Takamoto | 2012-09-18 |
| 8252700 | Method of heat treating silicon wafer | Takeshi Senda, Hiromichi Isogai, Kumiko Murayama, Koji Araki, Tatsuhiko Aoki +4 more | 2012-08-28 |