Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211083 | Film for flip chip type semiconductor back surface and its use | Goji Shiga, Fumiteru Asai | 2019-02-19 |
| 10141217 | Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device | Hiroyuki Hanazono, Akihiro Fukui | 2018-11-27 |
| 10014235 | Underfill material, laminated sheet and method for producing semiconductor device | Hiroyuki Hanazono, Akihiro Fukui | 2018-07-03 |
| 9911683 | Film for back surface of flip-chip semiconductor | Goji Shiga | 2018-03-06 |
| 9768050 | Film for semiconductor back surface and its use | Ryuichi KIMURA | 2017-09-19 |
| 9761475 | Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production | Goji Shiga, Fumiteru Asai | 2017-09-12 |
| 9679797 | Dicing-tape integrated film for backside of semiconductor and method of manufacturing semiconductor device | Hiroyuki Hanazono, Akihiro Fukui | 2017-06-13 |
| 9620403 | Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device | Goji Shiga | 2017-04-11 |
| 9478454 | Dicing tape-integrated film for semiconductor back surface | Goji Shiga, Fumiteru Asai, Toshimasa SUGIMURA | 2016-10-25 |
| 9472439 | Reinforcing sheet and method for producing secondary mounted semiconductor device | Kosuke Morita, Hiroyuki Senzai | 2016-10-18 |
| 9368421 | Under-fill material and method for producing semiconductor device | Kosuke Morita, Hiroyuki Senzai | 2016-06-14 |
| 9362156 | Dicing tape-integrated film for semiconductor back surface | Takeshi Matsumura, Goji Shiga | 2016-06-07 |
| 9324616 | Method of manufacturing flip-chip type semiconductor device | Goji Shiga, Fumiteru Asai | 2016-04-26 |
| 9293387 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Yusuke Komoto, Goji Shiga, Fumiteru Asai | 2016-03-22 |
| 9279064 | Manufacturing semiconductor device with film for forming protective layer | Takashi Oda, Takeshi Matsumura | 2016-03-08 |
| 9202795 | Laminated film and use thereof | Takashi Oda, Hiroyuki Senzai | 2015-12-01 |
| 9196533 | Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device | Goji Shiga | 2015-11-24 |
| 9085685 | Under-fill material and method for producing semiconductor device | Kosuke Morita, Hiroyuki Senzai | 2015-07-21 |
| 9074113 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Goji Shiga, Fumiteru Asai | 2015-07-07 |
| 9050773 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Fumiteru Asai, Goji Shiga | 2015-06-09 |
| 9035466 | Dicing tape-integrated film for semiconductor back surface | Takeshi Matsumura, Goji Shiga | 2015-05-19 |
| 8986486 | Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production | Goji Shiga, Fumiteru Asai | 2015-03-24 |
| 8912665 | Dicing tape-integrated film for semiconductor back surface | Miki Hayashi | 2014-12-16 |
| 8841780 | Dicing tape-integrated wafer back surface protective film | Takeshi Matsumura | 2014-09-23 |
| 8766462 | Dicing tape-integrated wafer back surface protective film | Takeshi Matsumura | 2014-07-01 |