Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211083 | Film for flip chip type semiconductor back surface and its use | Naohide Takamoto, Goji Shiga | 2019-02-19 |
| 9761475 | Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production | Naohide Takamoto, Goji Shiga | 2017-09-12 |
| 9478454 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Goji Shiga, Toshimasa SUGIMURA | 2016-10-25 |
| 9324616 | Method of manufacturing flip-chip type semiconductor device | Goji Shiga, Naohide Takamoto | 2016-04-26 |
| 9293387 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Yusuke Komoto, Naohide Takamoto, Goji Shiga | 2016-03-22 |
| 9074113 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Naohide Takamoto, Goji Shiga | 2015-07-07 |
| 9050773 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Goji Shiga, Naohide Takamoto | 2015-06-09 |
| 8986486 | Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production | Naohide Takamoto, Goji Shiga | 2015-03-24 |
| 8722517 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Goji Shiga, Toshimasa SUGIMURA | 2014-05-13 |
| 8679931 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Goji Shiga, Naohide Takamoto | 2014-03-25 |
| 8652938 | Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device | Naohide Takamoto, Goji Shiga | 2014-02-18 |
| 8643194 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Goji Shiga, Akiyoshi Yamamoto, Tomokazu Takahashi | 2014-02-04 |
| 8546958 | Pressure-sensitive adhesive sheet for protecting semiconductor wafer | Takashi HABU, Tomokazu Takahashi, Eiichi Imoto, Yuta Shimazaki | 2013-10-01 |
| 8513816 | Film for flip chip type semiconductor back surface containing thermoconductive filler | Naohide Takamoto, Goji Shiga | 2013-08-20 |
| 8492907 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Naohide Takamoto, Goji Shiga | 2013-07-23 |
| 8455302 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Goji Shiga, Naohide Takamoto | 2013-06-04 |
| 8450189 | Film for flip chip type semiconductor back surface | Goji Shiga, Naohide Takamoto | 2013-05-28 |
| 8404522 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Goji Shiga, Naohide Takamoto | 2013-03-26 |
| 8388786 | Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheet | Takashi HABU, Tomokazu Takahashi, Akinori Nishio, Toshio Shintani | 2013-03-05 |
| 8278151 | Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip | Shuhei Murata, Takeshi Matsumura, Koji Mizuno | 2012-10-02 |
| 8146438 | Pressure-sensitive adhesive sheet for testing | Yoshio Terada, Hirokuni Hashimoto | 2012-04-03 |
| 8048690 | Pressure-sensitive adhesive sheet and process for producing semiconductor device having same | Yoshio Terada, Hirokuni Hashimoto | 2011-11-01 |
| 7943235 | Adhesive sheet for processing semiconductor substrates | Akiyoshi Yamamoto, Toshio Shintani, Kouichi Hashimoto | 2011-05-17 |
| 7727811 | Pressure-sensitive adhesive sheet for processing semiconductor wafer or semiconductor substrate | Toshio Shintani | 2010-06-01 |
| 7231706 | Method of manufacturing an anisotropic conductive film | Miho Yamaguchi, Ichiro Suehiro, Yuji Hotta | 2007-06-19 |