Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297470 | Resin sheet for sealing electronic device and method for manufacturing electronic-device package | Yusaku Shimizu, Eiji Toyoda | 2019-05-21 |
| 10211083 | Film for flip chip type semiconductor back surface and its use | Naohide Takamoto, Fumiteru Asai | 2019-02-19 |
| 10128131 | Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device | Tsuyoshi Ishizaka, Kosuke Morita, Chie Iino | 2018-11-13 |
| 10074582 | Sealing sheet | Jun Ishii, Chie Iino | 2018-09-11 |
| 9911683 | Film for back surface of flip-chip semiconductor | Naohide Takamoto | 2018-03-06 |
| 9761475 | Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production | Naohide Takamoto, Fumiteru Asai | 2017-09-12 |
| 9754894 | Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing | Chie Iino, Takeshi Matsumura, Kosuke Morita | 2017-09-05 |
| 9659883 | Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package | Kosuke Morita, Tsuyoshi Ishizaka, Eiji Toyoda, Chie Iino, Jun Ishii | 2017-05-23 |
| 9620403 | Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor device | Naohide Takamoto | 2017-04-11 |
| 9478454 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Fumiteru Asai, Toshimasa SUGIMURA | 2016-10-25 |
| 9362156 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Takeshi Matsumura | 2016-06-07 |
| 9324616 | Method of manufacturing flip-chip type semiconductor device | Fumiteru Asai, Naohide Takamoto | 2016-04-26 |
| 9293387 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Yusuke Komoto, Naohide Takamoto, Fumiteru Asai | 2016-03-22 |
| 9196533 | Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor device | Naohide Takamoto | 2015-11-24 |
| 9074113 | Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device | Naohide Takamoto, Fumiteru Asai | 2015-07-07 |
| 9050773 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Fumiteru Asai, Naohide Takamoto | 2015-06-09 |
| 9035466 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Takeshi Matsumura | 2015-05-19 |
| 8986486 | Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production | Naohide Takamoto, Fumiteru Asai | 2015-03-24 |
| 8722517 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Fumiteru Asai, Toshimasa SUGIMURA | 2014-05-13 |
| 8704382 | Film for flip chip type semiconductor back surface | Naohide Takamoto, Takeshi Matsumura | 2014-04-22 |
| 8692389 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Takeshi Matsumura | 2014-04-08 |
| 8679931 | Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device | Fumiteru Asai, Naohide Takamoto | 2014-03-25 |
| 8652938 | Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device | Naohide Takamoto, Fumiteru Asai | 2014-02-18 |
| 8643194 | Dicing tape-integrated film for semiconductor back surface | Naohide Takamoto, Fumiteru Asai, Akiyoshi Yamamoto, Tomokazu Takahashi | 2014-02-04 |
| 8513816 | Film for flip chip type semiconductor back surface containing thermoconductive filler | Naohide Takamoto, Fumiteru Asai | 2013-08-20 |