Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10301509 | Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape | Yuki Sugo, Nao Kamakura, Mitsuaki Fusumada | 2019-05-28 |
| 10128131 | Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device | Goji Shiga, Kosuke Morita, Chie Iino | 2018-11-13 |
| 9659883 | Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package | Kosuke Morita, Eiji Toyoda, Goji Shiga, Chie Iino, Jun Ishii | 2017-05-23 |
| 7268191 | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby | Eiji Toyoda, Takeshi Okada, Keisuke Yoshikawa, Takuya Eto, Kazuhiro Ikemura +3 more | 2007-09-11 |