Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8525351 | Semiconductor device, substrate for producing semiconductor device and method of producing them | Chikao Ikenaga, Kentarou Seki, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa | 2013-09-03 |
| 8018044 | Semiconductor device, substrate for producing semiconductor device and method of producing them | Chikao Ikenaga, Kentarou Seki, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa | 2011-09-13 |
| 7943427 | Semiconductor device, substrate for producing semiconductor device and method of producing them | Chikao Ikenaga, Kentarou Seki, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa | 2011-05-17 |
| 7501711 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | Takuya Eto, Eiji Toyoda, Katsuyuki Nakabayashi, Daisuke Tsukahara | 2009-03-10 |
| 7365441 | Semiconductor device fabricating apparatus and semiconductor device fabricating method | Chikao Ikenaga, You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Takuji Okeyui +1 more | 2008-04-29 |
| 7268191 | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby | Eiji Toyoda, Takeshi Okada, Keisuke Yoshikawa, Takuya Eto, Shinya Akizuki +3 more | 2007-09-11 |
| 7265167 | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same | Shinya Akizuki, Hisataka Ito, Takahiro Uchida, Takuya Eto, Tsutomu Nishioka +1 more | 2007-09-04 |
| 7262514 | Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device | Keisuke Yoshikawa, Kazuhito Hosokawa, Takuji Okeyui | 2007-08-28 |
| 7132755 | Adhesive film for manufacturing semiconductor device | Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa | 2006-11-07 |
| 7064011 | Semiconductor device fabricating apparatus and semiconductor device fabricating method | Chikao Ikenaga, You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Takuji Okeyui +1 more | 2006-06-20 |
| 6410615 | Semiconductor sealing epoxy resin composition and semiconductor device using the same | Takashi Taniguchi, Minoru Yamane, Tsutomu Nishioka, Tadaaki Harada, Toshitsugu Hosokawa +2 more | 2002-06-25 |
| 6248454 | Epoxy resin composition for semiconductor encapsulation and semiconductor device | — | 2001-06-19 |
| 5976916 | Method of producing semiconductor device and encapsulating pellet employed therein | Makoto Kuwamura, Shinya Akizuki, Takashi Fukushima, Shinichiro Sudo, Satoshi Ito | 1999-11-02 |
| 5565709 | Semiconductor device | Takashi Fukushima, Satoshi Ito, Makoto Kuwamura, Shinya Akizuki, Shinichiro Sudo | 1996-10-15 |
| 5294835 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | Kazumasa Igarashi, Hideto Kimura, Megumu Nagasawa, Tsutomu Nishioka, Hideyuki Usui +3 more | 1994-03-15 |