Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8215947 | Molding die | Takashi Kato, Kazuhisa Fujiwara, Takashi Nagata, Tomoyuki Ishiyama | 2012-07-10 |
| 7501711 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | Kazuhiro Ikemura, Eiji Toyoda, Katsuyuki Nakabayashi, Daisuke Tsukahara | 2009-03-10 |
| 7359663 | Image forming apparatus | Hiroshi Inui | 2008-04-15 |
| 7268191 | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby | Eiji Toyoda, Takeshi Okada, Keisuke Yoshikawa, Kazuhiro Ikemura, Shinya Akizuki +3 more | 2007-09-11 |
| 7265167 | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same | Shinya Akizuki, Kazuhiro Ikemura, Hisataka Ito, Takahiro Uchida, Tsutomu Nishioka +1 more | 2007-09-04 |
| 6814353 | Automatic document feeder and image forming device | Masayuki Kakuta, Hiroyuki Harada | 2004-11-09 |