Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7268191 | Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby | Eiji Toyoda, Takeshi Okada, Keisuke Yoshikawa, Takuya Eto, Kazuhiro Ikemura +3 more | 2007-09-11 |
| 7265167 | Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same | Kazuhiro Ikemura, Hisataka Ito, Takahiro Uchida, Takuya Eto, Tsutomu Nishioka +1 more | 2007-09-04 |
| 5976916 | Method of producing semiconductor device and encapsulating pellet employed therein | Makoto Kuwamura, Kazuhiro Ikemura, Takashi Fukushima, Shinichiro Sudo, Satoshi Ito | 1999-11-02 |
| 5728321 | Organic polymer, conducting organic polymer, production methods and uses of the same | Masao Abe, Akira Ohtani, Hiroyuki Higuchi, Minoru Ezoe, Keiji Nakamoto +3 more | 1998-03-17 |
| 5565709 | Semiconductor device | Takashi Fukushima, Satoshi Ito, Makoto Kuwamura, Kazuhiro Ikemura, Shinichiro Sudo | 1996-10-15 |
| 5334674 | Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions | Akihiro Naka, Shuichi Ito, Kiyoshi Saito | 1994-08-02 |
| 5302673 | Poly-hydroxynaphthalene compounds and epoxy resin composition | Akihiro Naka, Shuichi Ito, Kiyoshi Saito | 1994-04-12 |
| 5264552 | Organic polymer, conducting organic polymer, production methods and uses of the same | Masao Abe, Akira Ohtani, Hiroyuki Higuchi, Minoru Ezoe, Keiji Nakamoto +3 more | 1993-11-23 |