Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8525351 | Semiconductor device, substrate for producing semiconductor device and method of producing them | Chikao Ikenaga, Kentarou Seki, Kazuhito Hosokawa, Keisuke Yoshikawa, Kazuhiro Ikemura | 2013-09-03 |
| 8018044 | Semiconductor device, substrate for producing semiconductor device and method of producing them | Chikao Ikenaga, Kentarou Seki, Kazuhito Hosokawa, Keisuke Yoshikawa, Kazuhiro Ikemura | 2011-09-13 |
| 7943427 | Semiconductor device, substrate for producing semiconductor device and method of producing them | Chikao Ikenaga, Kentarou Seki, Kazuhito Hosokawa, Keisuke Yoshikawa, Kazuhiro Ikemura | 2011-05-17 |
| 7862954 | Fuel cell | Masaya Yano, Masakazu Sugimoto, Toshio Araki | 2011-01-04 |
| 7365441 | Semiconductor device fabricating apparatus and semiconductor device fabricating method | Chikao Ikenaga, You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Keisuke Yoshikawa +1 more | 2008-04-29 |
| 7262514 | Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device | Keisuke Yoshikawa, Kazuhito Hosokawa, Kazuhiro Ikemura | 2007-08-28 |
| 7235888 | Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device | Kazuhito Hosokawa, Hirofumi Fujii, Yasuhiko Yamamoto | 2007-06-26 |
| 7132755 | Adhesive film for manufacturing semiconductor device | Kazuhito Hosokawa, Kazuhiro Ikemura, Keisuke Yoshikawa | 2006-11-07 |
| 7064011 | Semiconductor device fabricating apparatus and semiconductor device fabricating method | Chikao Ikenaga, You Shimazaki, Masachika Masuda, Kazuhito Hosokawa, Keisuke Yoshikawa +1 more | 2006-06-20 |
| 6858473 | Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device | Kazuhito Hosokawa, Hirofumi Fujii, Yasuhik Yamamoto | 2005-02-22 |
| 6565704 | Process for the removal of resist material | Eiji Toyoda, Makoto Namikawa | 2003-05-20 |
| 6373000 | Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board | Kei Nakamura, Masakazu Sugimoto, Yasushi Inoue, Megumu Nagasawa, Masayuki Kaneto +1 more | 2002-04-16 |
| 6335076 | Multi-layer wiring board and method for manufacturing the same | Kei Nakamura, Masakazu Sugimoto, Yasushi Inoue, Megumu Nagasawa | 2002-01-01 |
| 6333469 | Wafer-scale package structure and circuit board attached thereto | Yasushi Inoue, Masakazu Sugimoto, Megumu Nagasawa, Kei Nakamura | 2001-12-25 |
| 6245188 | Process for the removal of resist material | Eiji Toyoda, Makoto Namikawa | 2001-06-12 |