Issued Patents All Time
Showing 1–25 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9870983 | Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device | Satoshi Shibasaki, Koji Tomita, Masaki Yazaki, Kazuyuki Miyano, Atsushi Kurahashi +1 more | 2018-01-16 |
| 9543169 | Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device | Satoshi Shibasaki, Koji Tomita, Masaki Yazaki, Kazuyuki Miyano, Atsushi Kurahashi +1 more | 2017-01-10 |
| 9324636 | Resin-sealed semiconductor device and associated wiring and support structure | Susumu Baba, Hiromichi Suzuki | 2016-04-26 |
| RE45931 | Method of manufacturing a semiconductor device | Tsutomu Wada | 2016-03-15 |
| 9263374 | Semiconductor device and manufacturing method therefor | Koji Tomita, Tadashi Okamoto, Yasunori Tanaka, Hiroshi Ohsawa, Kazuyuki Miyano +2 more | 2016-02-16 |
| 9257306 | Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device | Satoshi Shibasaki, Koji Tomita, Masaki Yazaki, Kazuyuki Miyano, Atsushi Kurahashi +1 more | 2016-02-09 |
| 9159706 | Semiconductor device and a method of manufacturing the same | Toshihiko Usami | 2015-10-13 |
| 8853864 | Semiconductor device and a method of manufacturing the same | Toshihiko Usami | 2014-10-07 |
| 8796832 | Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device | Susumu Baba, Hiromichi Suzuki | 2014-08-05 |
| 8742554 | Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member | Yo Shimazaki, Hiroyuki Saito, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa | 2014-06-03 |
| 8739401 | Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member | Yo Shimazaki, Hiroyuki Saito, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa | 2014-06-03 |
| 8653647 | Plastic package and method of fabricating the same | Chikao Ikenaga | 2014-02-18 |
| 8502395 | Semiconductor device and a method of manufacturing the same | Toshihiko Usami | 2013-08-06 |
| 8471371 | Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device | Susumu Baba, Hiromichi Suzuki | 2013-06-25 |
| 8420446 | Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member | Shimazaki Yo, Hiroyuki Saito, Kenji Matsumura, Masaru Fukuchi, Takao Ikezawa | 2013-04-16 |
| 8247888 | Semiconductor device and method for manufacturing metallic shielding plate | Kazunori Oda, Koji Tomita, Kazuyuki Miyano | 2012-08-21 |
| 8159062 | Semiconductor and a method of manufacturing the same | Toshihiko Usami | 2012-04-17 |
| 8148804 | Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device | Susumu Baba, Hiromichi Suzuki | 2012-04-03 |
| 8067251 | Semiconductor device and a method of manufacturing the same | Toshihiko Usami | 2011-11-29 |
| 7879647 | Semiconductor device and a method of manufacturing the same | Toshihiko Usami | 2011-02-01 |
| 7851902 | Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device | Chikao Ikenaga, Koji Tomita | 2010-12-14 |
| 7633146 | Semiconductor device and a method of manufacturing the same | Toshihiko Usami | 2009-12-15 |
| 7405468 | Plastic package and method of fabricating the same | Chikao Ikenaga | 2008-07-29 |
| 7365441 | Semiconductor device fabricating apparatus and semiconductor device fabricating method | Chikao Ikenaga, You Shimazaki, Kazuhito Hosokawa, Takuji Okeyui, Keisuke Yoshikawa +1 more | 2008-04-29 |
| 7348668 | Semiconductor device and method of manufacturing the same | Toshihiko Usami | 2008-03-25 |