Issued Patents All Time
Showing 51–75 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6545349 | Semiconductor device | Akihiko Iwaya, Tamaki Wada | 2003-04-08 |
| 6538331 | Semiconductor device and a method of manufacturing the same | Toshihiko Usami | 2003-03-25 |
| 6531773 | Semiconductor device | Hirotaka Nishizawa, Kouichi Kanemoto, Tamaki Wada | 2003-03-11 |
| 6501173 | Semiconductor device | Hirotaka Nishizawa, Kouichi Kanemoto, Tamaki Wada | 2002-12-31 |
| 6501183 | Semiconductor device and a method of manufacturing the same and an electronic device | Kouichi Kanemoto, Tamaki Wada, Michiaki Sugiyama, Mikako Kimura | 2002-12-31 |
| 6492727 | Semiconductor device | Hirotaka Nishizawa, Kouichi Kanemoto, Tamaki Wada | 2002-12-10 |
| 6452266 | Semiconductor device | Akihiko Iwaya, Toshio Sugano, Susumu Hatano, Yutaka Kagaya | 2002-09-17 |
| 6433421 | Semiconductor device | Tamaki Wada, Hirotaka Nishizawa, Koich Iro Kagaya | 2002-08-13 |
| 6410987 | Semiconductor device and a method of manufacturing the same and an electronic device | Kouichi Kanemoto, Tamaki Wada, Michiaki Sugiyama, Mikako Kimura | 2002-06-25 |
| 6392295 | Semiconductor device | Akihiko Iwaya, Tamaki Wada | 2002-05-21 |
| 6388318 | Surface mount-type package of ball grid array with multi-chip mounting | Akihiko Iwaya, Toshio Sugano, Susumu Hatano, Yutaka Kagaya | 2002-05-14 |
| 6383845 | Stacked semiconductor device including improved lead frame arrangement | Tamaki Wada, Michiaki Sugiyama, Hirotaka Nishizawa, Toshio Sugano, Yasushi Takahashi +1 more | 2002-05-07 |
| 6337521 | Semiconductor device and a method of manufacturing the same | — | 2002-01-08 |
| 6335227 | Method of fabricating a lead-on-chip (LOC) semiconductor device | Kunihiro Tsubosaki, Akihiko Iwaya, Atsushi Nakamura, Chikako Imura, Toshihiro Shiotsuki | 2002-01-01 |
| 6297544 | Semiconductor device and method for manufacturing the same | Atsushi Nakamura, Mitsuaki Katagiri, Kunihiro Tsubosaki, Asao Nishimura | 2001-10-02 |
| 6297545 | Semiconductor device | Michiaki Sugiyama, Tamaki Wada | 2001-10-02 |
| 6285074 | Semiconductor device | Michiaki Sugiyama, Tamaki Wada | 2001-09-04 |
| 6252299 | Stacked semiconductor device including improved lead frame arrangement | Tamaki Wada, Michiaki Sugiyama, Hirotaka Nishizawa, Toshio Sugano, Yasushi Takahashi +1 more | 2001-06-26 |
| 6201297 | Semiconductor device | — | 2001-03-13 |
| 6169325 | Semiconductor device | Shuichiro Azuma, Takayuki Okinaga, Takashi Emata, Tomoaki Kudaishi, Tamaki Wada +2 more | 2001-01-02 |
| 6153922 | Semiconductor device | Michiaki Sugiyama, Tamaki Wada | 2000-11-28 |
| 6137159 | Lead on chip semiconductor device and method of fabricating the same | Kunihiro Tsubosaki, Akihiko Iwaya, Atsushi Nakamura, Chikako Imura, Toshihiro Shiotsuki | 2000-10-24 |
| 6097081 | Semiconductor device having adhesive between lead and chip | Michiaki Sugiyama | 2000-08-01 |
| 6064112 | Resin-molded semiconductor device having a lead on chip structure | Akihiko Iwaya, Tamaki Wada, Kunihiro Tsubosaki, Asao Nishimura | 2000-05-16 |
| 5895969 | Thin type semiconductor device, module structure using the device and method of mounting the device on board | Tamaki Wada | 1999-04-20 |