Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705432 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices | Hiroki Fujisawa, Raj K. Bansal, Shunji Kuwahara, Satoshi Isa | 2023-07-18 |
| 11081468 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses | Hiroki Fujisawa, Raj K. Bansal, Shunji Kuwahara, Satoshi Isa | 2021-08-03 |
| 10600762 | Apparatuses comprising semiconductor dies in face-to-face arrangements | Dai Sasaki, Satoshi Isa | 2020-03-24 |
| 10431566 | Apparatuses comprising semiconductor dies in face-to-face arrangements | Dai Sasaki, Satoshi Isa | 2019-10-01 |
| 10115709 | Apparatuses comprising semiconductor dies in face-to-face arrangements | Dai Sasaki, Satoshi Isa | 2018-10-30 |
| 9595489 | Semiconductor package with bonding wires of reduced loop inductance | Ken Iwakura, Yutaka Uematsu | 2017-03-14 |
| 9589921 | Semiconductor device | Yu Hasegawa, Satoshi Isa | 2017-03-07 |
| 9418967 | Semiconductor device | Kazutaka Koshiishi, Satoshi Isa, Dai Sasaki | 2016-08-16 |
| 9048221 | Device having electrodes formed from bumps with different diameters | Yu Hasegawa | 2015-06-02 |
| 8970052 | Semiconductor device stack with bonding layer and wire retaining member | Yu Hasegawa, Satoshi Isa, Ken Iwakura, Dai Sasaki | 2015-03-03 |
| 8941237 | Semiconductor device | Yu Hasegawa | 2015-01-27 |
| 8853822 | Semiconductor device | Hiroki Fujisawa, Hiromasa Takeda, Ken Iwakura, Yutaka Uematsu, Go SHINKAI | 2014-10-07 |
| 8796077 | Semiconductor device | Hiromasa Takeda, Satoshi Isa, Dai Sasaki | 2014-08-05 |
| 8680881 | Test method and interposer used therefor | Yutaka Uematsu, Hideki Osaka, Satoshi Nakamura, Satoshi Muraoka, Ken Iwakura +1 more | 2014-03-25 |
| 8633596 | Semiconductor package with bonding wires of reduced loop inductance | Ken Iwakura, Yutaka Uematsu | 2014-01-21 |
| 8604601 | Semiconductor device having wiring layers with power-supply plane and ground plane | Satoshi Isa | 2013-12-10 |
| 8587097 | Semiconductor device that suppresses malfunctions due to noise generated in internal circuit | Hiromasa Takeda, Satoshi Isa, Shotaro Kobayashi | 2013-11-19 |
| 8581417 | Semiconductor device stack with bonding layer and wire retaining member | Yu Hasegawa, Satoshi Isa, Ken Iwakura, Dai Sasaki | 2013-11-12 |
| 8569898 | Semiconductor device | Hiromasa Takeda, Satoshi Isa, Dai Sasaki | 2013-10-29 |
| 8513803 | Semiconductor device and stacked semiconductor device | Dai Sasaki, Hisashi Tanie | 2013-08-20 |
| 8487433 | Semiconductor device | Yu Hasegawa | 2013-07-16 |
| 8426983 | Semiconductor device | Hiromasa Takeda, Satoshi Isa | 2013-04-23 |
| 8372693 | Semiconductor device including semiconductor chips with different thickness | Hisashi Tanie, Jun Kayamori, Dai Sasaki, Hiroshi Moriya | 2013-02-12 |
| 8362614 | Fine pitch grid array type semiconductor device | Hiroya Shimizu, Fumiyuki Osanai, Yasushi Takahashi, Seiji Narui | 2013-01-29 |
| 8331182 | Semiconductor device including plural electrode pads | Hiromasa Takeda, Satoshi Isa, Shotaro Kobayashi | 2012-12-11 |