Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705432 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices | Hiroki Fujisawa, Raj K. Bansal, Shunji Kuwahara, Mitsuaki Katagiri | 2023-07-18 |
| 11081468 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses | Hiroki Fujisawa, Raj K. Bansal, Shunji Kuwahara, Mitsuaki Katagiri | 2021-08-03 |
| 10600762 | Apparatuses comprising semiconductor dies in face-to-face arrangements | Dai Sasaki, Mitsuaki Katagiri | 2020-03-24 |
| 10431566 | Apparatuses comprising semiconductor dies in face-to-face arrangements | Dai Sasaki, Mitsuaki Katagiri | 2019-10-01 |
| 10115709 | Apparatuses comprising semiconductor dies in face-to-face arrangements | Dai Sasaki, Mitsuaki Katagiri | 2018-10-30 |
| 9589921 | Semiconductor device | Mitsuaki Katagiri, Yu Hasegawa | 2017-03-07 |
| 9418967 | Semiconductor device | Kazutaka Koshiishi, Mitsuaki Katagiri, Dai Sasaki | 2016-08-16 |
| 9159663 | Semiconductor device with respective electrode pad rows and respective external electrodes electrically connected and arranged in the respective end portions of the substrate | Hiromasa Takeda, Kouji Sato | 2015-10-13 |
| 8970052 | Semiconductor device stack with bonding layer and wire retaining member | Yu Hasegawa, Mitsuaki Katagiri, Ken Iwakura, Dai Sasaki | 2015-03-03 |
| 8796077 | Semiconductor device | Hiromasa Takeda, Mitsuaki Katagiri, Dai Sasaki | 2014-08-05 |
| 8604601 | Semiconductor device having wiring layers with power-supply plane and ground plane | Mitsuaki Katagiri | 2013-12-10 |
| 8587097 | Semiconductor device that suppresses malfunctions due to noise generated in internal circuit | Hiromasa Takeda, Shotaro Kobayashi, Mitsuaki Katagiri | 2013-11-19 |
| 8581417 | Semiconductor device stack with bonding layer and wire retaining member | Yu Hasegawa, Mitsuaki Katagiri, Ken Iwakura, Dai Sasaki | 2013-11-12 |
| 8569898 | Semiconductor device | Hiromasa Takeda, Mitsuaki Katagiri, Dai Sasaki | 2013-10-29 |
| 8426983 | Semiconductor device | Hiromasa Takeda, Mitsuaki Katagiri | 2013-04-23 |
| 8331182 | Semiconductor device including plural electrode pads | Hiromasa Takeda, Shotaro Kobayashi, Mitsuaki Katagiri | 2012-12-11 |
| 8243465 | Semiconductor device with additional power supply paths | Satoshi Itaya, Mitsuaki Katagiri, Dai Sasaki | 2012-08-14 |
| 8063476 | Semiconductor device | Kazutaka Koshiishi, Mitsuaki Katagiri, Dai Sasaki | 2011-11-22 |
| 7956470 | Semiconductor device | Mitsuaki Katagiri, Toru Chonan, Shigeyuki Nakazawa | 2011-06-07 |
| 7944026 | Semiconductor device | Kazutaka Koshiishi, Mitsuaki Katagiri, Haruo Akahoshi | 2011-05-17 |
| 7875986 | Semiconductor device | Mitsuaki Katagiri, Kyoichi Nagata, Seiji Narui | 2011-01-25 |
| 7847377 | Semiconductor device including semiconductor chip with two pad rows | Fumiyuki Osanai, Mitsuaki Katagiri | 2010-12-07 |
| 7823096 | Inductance analysis system and method and program therefor | Mitsuaki Katagiri, Takashi Iida, Hiroya Shimizu | 2010-10-26 |
| 7816768 | Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planes | Kazutaka Koshiishi, Mitsuaki Katagiri | 2010-10-19 |
| 7777350 | Semiconductor stack package having wiring extension part which has hole for wiring | Dai Sasaki, Mitsuaki Katagiri | 2010-08-17 |