| 11705432 |
Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices |
Hiroki Fujisawa, Raj K. Bansal, Shunji Kuwahara, Mitsuaki Katagiri |
2023-07-18 |
$8,312,000 |
| 11081468 |
Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses |
Hiroki Fujisawa, Raj K. Bansal, Shunji Kuwahara, Mitsuaki Katagiri |
2021-08-03 |
$20,873,000 |
| 10600762 |
Apparatuses comprising semiconductor dies in face-to-face arrangements |
Dai Sasaki, Mitsuaki Katagiri |
2020-03-24 |
$12,287,000 |
| 10431566 |
Apparatuses comprising semiconductor dies in face-to-face arrangements |
Dai Sasaki, Mitsuaki Katagiri |
2019-10-01 |
$10,821,000 |
| 10115709 |
Apparatuses comprising semiconductor dies in face-to-face arrangements |
Dai Sasaki, Mitsuaki Katagiri |
2018-10-30 |
$45,682,000 |
| 9589921 |
Semiconductor device |
Mitsuaki Katagiri, Yu Hasegawa |
2017-03-07 |
|
| 9418967 |
Semiconductor device |
Kazutaka Koshiishi, Mitsuaki Katagiri, Dai Sasaki |
2016-08-16 |
|
| 9159663 |
Semiconductor device with respective electrode pad rows and respective external electrodes electrically connected and arranged in the respective end portions of the substrate |
Hiromasa Takeda, Kouji Sato |
2015-10-13 |
|
| 8970052 |
Semiconductor device stack with bonding layer and wire retaining member |
Yu Hasegawa, Mitsuaki Katagiri, Ken Iwakura, Dai Sasaki |
2015-03-03 |
|
| 8796077 |
Semiconductor device |
Hiromasa Takeda, Mitsuaki Katagiri, Dai Sasaki |
2014-08-05 |
|
| 8604601 |
Semiconductor device having wiring layers with power-supply plane and ground plane |
Mitsuaki Katagiri |
2013-12-10 |
$6,972,000 |
| 8587097 |
Semiconductor device that suppresses malfunctions due to noise generated in internal circuit |
Hiromasa Takeda, Shotaro Kobayashi, Mitsuaki Katagiri |
2013-11-19 |
$7,954,000 |
| 8581417 |
Semiconductor device stack with bonding layer and wire retaining member |
Yu Hasegawa, Mitsuaki Katagiri, Ken Iwakura, Dai Sasaki |
2013-11-12 |
$5,415,000 |
| 8569898 |
Semiconductor device |
Hiromasa Takeda, Mitsuaki Katagiri, Dai Sasaki |
2013-10-29 |
$5,369,000 |
| 8426983 |
Semiconductor device |
Hiromasa Takeda, Mitsuaki Katagiri |
2013-04-23 |
$4,526,000 |
| 8331182 |
Semiconductor device including plural electrode pads |
Hiromasa Takeda, Shotaro Kobayashi, Mitsuaki Katagiri |
2012-12-11 |
$3,231,000 |
| 8243465 |
Semiconductor device with additional power supply paths |
Satoshi Itaya, Mitsuaki Katagiri, Dai Sasaki |
2012-08-14 |
$3,153,000 |
| 8063476 |
Semiconductor device |
Kazutaka Koshiishi, Mitsuaki Katagiri, Dai Sasaki |
2011-11-22 |
$2,392,000 |
| 7956470 |
Semiconductor device |
Mitsuaki Katagiri, Toru Chonan, Shigeyuki Nakazawa |
2011-06-07 |
$3,124,000 |
| 7944026 |
Semiconductor device |
Kazutaka Koshiishi, Mitsuaki Katagiri, Haruo Akahoshi |
2011-05-17 |
$3,305,000 |
| 7875986 |
Semiconductor device |
Mitsuaki Katagiri, Kyoichi Nagata, Seiji Narui |
2011-01-25 |
$5,663,000 |
| 7847377 |
Semiconductor device including semiconductor chip with two pad rows |
Fumiyuki Osanai, Mitsuaki Katagiri |
2010-12-07 |
|
| 7823096 |
Inductance analysis system and method and program therefor |
Mitsuaki Katagiri, Takashi Iida, Hiroya Shimizu |
2010-10-26 |
$3,167,000 |
| 7816768 |
Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planes |
Kazutaka Koshiishi, Mitsuaki Katagiri |
2010-10-19 |
$3,380,000 |
| 7777350 |
Semiconductor stack package having wiring extension part which has hole for wiring |
Dai Sasaki, Mitsuaki Katagiri |
2010-08-17 |
$3,732,000 |
