Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705432 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding, and related methods and devices | Hiroki Fujisawa, Raj K. Bansal, Mitsuaki Katagiri, Satoshi Isa | 2023-07-18 |
| 11081468 | Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses | Hiroki Fujisawa, Raj K. Bansal, Mitsuaki Katagiri, Satoshi Isa | 2021-08-03 |
| 9041436 | Semiconductor device having pull-up circuit and pull-down circuit | Hiroki Fujisawa | 2015-05-26 |
| 8461867 | Semiconductor device having plural unit buffers constituting output buffer | Hiroki Fujisawa | 2013-06-11 |
| 8278973 | Impedance control circuit and semiconductor device including the same | Hiroki Fujisawa | 2012-10-02 |
| 7902858 | Calibration circuit, semiconductor device including the same, and memory module | Hiroki Fujisawa | 2011-03-08 |
| 7872493 | Calibration circuit | Hiroki Fujisawa | 2011-01-18 |