Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8739401 | Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member | Yo Shimazaki, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Takao Ikezawa | 2014-06-03 |
| 8742554 | Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member | Yo Shimazaki, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Takao Ikezawa | 2014-06-03 |
| 8420446 | Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member | Shimazaki Yo, Hiroyuki Saito, Masachika Masuda, Kenji Matsumura, Takao Ikezawa | 2013-04-16 |