Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8142956 | Fuel cell | Masao Abe | 2012-03-27 |
| 6462282 | Circuit board for mounting bare chip | Yasushi Inoue, Masakazu Sugimoto, Kei Nakamura | 2002-10-08 |
| 6373000 | Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board | Kei Nakamura, Masakazu Sugimoto, Yasushi Inoue, Takuji Okeyui, Masayuki Kaneto +1 more | 2002-04-16 |
| 6335076 | Multi-layer wiring board and method for manufacturing the same | Kei Nakamura, Masakazu Sugimoto, Yasushi Inoue, Takuji Okeyui | 2002-01-01 |
| 6333469 | Wafer-scale package structure and circuit board attached thereto | Yasushi Inoue, Masakazu Sugimoto, Takuji Okeyui, Kei Nakamura | 2001-12-25 |
| 6310391 | Mounted structure of circuit board and multi-layer circuit board therefor | Masakazu Sugimoto, Yasushi Inoue, Kei Nakamura | 2001-10-30 |
| 6258449 | Low-thermal expansion circuit board and multilayer circuit board | Masakazu Sugimoto, Yasushi Inoue, Kei Nakamura | 2001-07-10 |
| 5990546 | Chip scale package type of semiconductor device | Kazumasa Igarashi, Satoshi Tanigawa, Hideyuki Usui, Nobuhiko Yoshio, Hisataka Ito | 1999-11-23 |
| 5814894 | Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device | Kazumasa Igarashi, Satoshi Tanigawa, Hideyuki Usui, Nobuhiko Yoshio, Hisataka Ito +1 more | 1998-09-29 |
| 5294835 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | Kazumasa Igarashi, Hideto Kimura, Tsutomu Nishioka, Kazuhiro Ikemura, Hideyuki Usui +3 more | 1994-03-15 |