Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080517 | Ignition method and plasma processing apparatus | Takeshi Kobayashi, Takeshi Ando | 2024-09-03 |
| 11923177 | Plasma processing apparatus and plasma processing method | Keiji TABUKI, Yamato Tonegawa, Kazuo Yabe | 2024-03-05 |
| 11781219 | Processing apparatus and processing method | Kazuo Yabe, Yamato Tonegawa | 2023-10-10 |
| 10025432 | Capacitive touch panel | Hiroaki Kishioka, Tomohide Banba, Mitsuru Honjo, Naoki Nagaoka, Yuki Hasegawa +3 more | 2018-07-17 |
| 9777366 | Thin film forming method | Akinobu Kakimoto, Atsushi Endo, Takahiro Miyahara, Shigeru Nakajima, Satoshi Takagi | 2017-10-03 |
| 9145604 | Thin film forming method and film forming apparatus | Akinobu Kakimoto, Atsushi Endo, Takahiro Miyahara, Shigeru Nakajima, Satoshi Takagi | 2015-09-29 |
| 8895414 | Method and apparatus for forming amorphous silicon film | Akinobu Kakimoto, Satoshi Takagi | 2014-11-25 |
| 8802547 | Method and apparatus for forming amorphous silicon film | Akinobu Kakimoto, Satoshi Takagi | 2014-08-12 |
| 8765833 | UV-curable optical resin adhesive composition | Yuki Hasegawa | 2014-07-01 |
| 8541099 | Heat-resistant resin | Hirofumi Fujii, Yoshio Terada | 2013-09-24 |
| 7352069 | Electronic component unit | Ichiro Hazeyama, Masahiro Kubo, Sakae Kitajo, Koji Matsui, Hiroshi Noro | 2008-04-01 |
| 7034405 | Resin component for encapsulating semiconductor and semiconductor device using it | Junichi Toyoda, Katsumi Okayama | 2006-04-25 |
| 6800804 | Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition | Junichi Toyoda, Katsumi Okayama | 2004-10-05 |
| 6695985 | Electromagnetic wave suppressor sheet | Junichi Toyoda, Katsumi Okayama | 2004-02-24 |
| 6674016 | Electronic component | Masahiro Kubo, Ichiro Hazeyama, Sakae Kitajo, Koji Matsui | 2004-01-06 |
| 6383660 | Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same | — | 2002-05-07 |
| 6333139 | Circuit-forming substrate and circuit substrate | Toshihiko Omote, Yasuhito Funada, Hideyuki Usui, Masanori Ueno | 2001-12-25 |
| 6117616 | Circuit-forming substrate and circuit substrate | Toshihiko Omote, Yasuhito Funada, Hideyuki Usui, Masanori Ueno | 2000-09-12 |
| 5990546 | Chip scale package type of semiconductor device | Megumu Nagasawa, Satoshi Tanigawa, Hideyuki Usui, Nobuhiko Yoshio, Hisataka Ito | 1999-11-23 |
| 5814894 | Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device | Megumu Nagasawa, Satoshi Tanigawa, Hideyuki Usui, Nobuhiko Yoshio, Hisataka Ito +1 more | 1998-09-29 |
| 5508742 | Color video camera apparatus using a CD includes a matrix circuit having matrix coefficients adjustable independence on the color signals | Jurgen Geerlings, Hiroshi Kitagawa | 1996-04-16 |
| 5294835 | Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same | Hideto Kimura, Megumu Nagasawa, Tsutomu Nishioka, Kazuhiro Ikemura, Hideyuki Usui +3 more | 1994-03-15 |
| 5120573 | Process for producing metal/polyimide composite article | Kunio Miyazaki, Osamu Miura, Ryuji Watanabe, Yukio Ookoshi, Toshio Miyamoto +2 more | 1992-06-09 |
| 5053314 | Positively photosensitive polyimide composition | Tsuguo Yamaoka, Amane Mochizuki, Toshihiko Omote | 1991-10-01 |
| 4520075 | Siloxane-modified polyimide precursor and polyimide | Katsuhiko Yamaguchi, Kazuo Iko, Kazuyuki Miki | 1985-05-28 |