Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10896827 | Support for manufacturing semiconductor packages, use of support for manufacturing semiconductor packages, and method for manufacturing semiconductor packages | — | 2021-01-19 |
| 9195327 | Touch panel and display device employing the same | Yukihiro Ito, Shizuo Morishita | 2015-11-24 |
| 7594644 | Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus | Takao Yamazaki, Hirobumi Inoue, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa +1 more | 2009-09-29 |
| 7352069 | Electronic component unit | Masahiro Kubo, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi, Hiroshi Noro | 2008-04-01 |
| 7230328 | Semiconductor package and laminated semiconductor package | Yoshimichi Sogawa, Takao Yamazaki, Sakae Kitajo | 2007-06-12 |
| 7119438 | Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device | Masahiro Kubo, Sakae Kitajo, Kazuhiko Futakami, Shinichi Ishiduka, Susumu Nanko +3 more | 2006-10-10 |
| 6998704 | Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus | Takao Yamazaki, Hirobumi Inoue, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa +1 more | 2006-02-14 |
| 6926188 | Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip | Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima +1 more | 2005-08-09 |
| 6889886 | Transfer apparatus for arraying small conductive bumps on substrate and/ or chip | Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima +1 more | 2005-05-10 |
| 6674016 | Electronic component | Masahiro Kubo, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi | 2004-01-06 |
| 6348424 | Low-temperature calcined glass ceramic and a manufacturing process therefor | Kazuhiro Ikuina | 2002-02-19 |
| 5902758 | Low temperature firing glass-ceramic substrate and production process thereof | Kazuhiro Ikuina | 1999-05-11 |
| 5728470 | Multi-layer wiring substrate, and process for producing the same | Kazuhiro Ikuina, Mitsuru Kimura | 1998-03-17 |
| 5714112 | Process for producing a silica sintered product for a multi-layer wiring substrate | Kazuhiro Ikuina, Mitsuru Kimura | 1998-02-03 |