| 10896827 |
Support for manufacturing semiconductor packages, use of support for manufacturing semiconductor packages, and method for manufacturing semiconductor packages |
— |
2021-01-19 |
| 9195327 |
Touch panel and display device employing the same |
Yukihiro Ito, Shizuo Morishita |
2015-11-24 |
| 7594644 |
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
Takao Yamazaki, Hirobumi Inoue, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa +1 more |
2009-09-29 |
| 7352069 |
Electronic component unit |
Masahiro Kubo, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi, Hiroshi Noro |
2008-04-01 |
| 7230328 |
Semiconductor package and laminated semiconductor package |
Yoshimichi Sogawa, Takao Yamazaki, Sakae Kitajo |
2007-06-12 |
| 7119438 |
Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device |
Masahiro Kubo, Sakae Kitajo, Kazuhiko Futakami, Shinichi Ishiduka, Susumu Nanko +3 more |
2006-10-10 |
| 6998704 |
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
Takao Yamazaki, Hirobumi Inoue, Sakae Kitajo, Masahiro Kubo, Yoshimichi Sogawa +1 more |
2006-02-14 |
| 6926188 |
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip |
Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima +1 more |
2005-08-09 |
| 6889886 |
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip |
Sakae Kitajo, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima +1 more |
2005-05-10 |
| 6674016 |
Electronic component |
Masahiro Kubo, Sakae Kitajo, Koji Matsui, Kazumasa Igarashi |
2004-01-06 |
| 6348424 |
Low-temperature calcined glass ceramic and a manufacturing process therefor |
Kazuhiro Ikuina |
2002-02-19 |
| 5902758 |
Low temperature firing glass-ceramic substrate and production process thereof |
Kazuhiro Ikuina |
1999-05-11 |
| 5728470 |
Multi-layer wiring substrate, and process for producing the same |
Kazuhiro Ikuina, Mitsuru Kimura |
1998-03-17 |
| 5714112 |
Process for producing a silica sintered product for a multi-layer wiring substrate |
Kazuhiro Ikuina, Mitsuru Kimura |
1998-02-03 |