Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8525323 | Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package | Takao Yamazaki, Masahiko Sano, Seiji Kurashina | 2013-09-03 |
| 8411450 | Electronic device package, module, and electronic device | Takao Yamazaki, Tomohiro Nishiyama | 2013-04-02 |
| 7812440 | Electronic package device, module, and electronic apparatus | Takao Yamazaki, Toshiaki Shironouchi, Kenji Ohyachi | 2010-10-12 |
| 7795585 | Vacuum package and manufacturing process thereof | Takao Yamazaki, Masahiko Sano, Seiji Kurashina, Yuji Akimoto | 2010-09-14 |
| 7594644 | Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus | Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo +1 more | 2009-09-29 |
| 7230328 | Semiconductor package and laminated semiconductor package | Ichiro Hazeyama, Takao Yamazaki, Sakae Kitajo | 2007-06-12 |
| 6998704 | Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus | Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Sakae Kitajo, Masahiro Kubo +1 more | 2006-02-14 |