Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7812440 | Electronic package device, module, and electronic apparatus | Takao Yamazaki, Yoshimichi Sogawa, Kenji Ohyachi | 2010-10-12 |
| 6930396 | Semiconductor device and method for manufacturing the same | Yoichiro Kurita, Takashi Tetsuka | 2005-08-16 |
| 6180435 | Semiconductor device with economical compact package and process for fabricating semiconductor device | Hiroshi Ise | 2001-01-30 |
| 6086641 | Die bonder for a semiconductor producing apparatus | — | 2000-07-11 |