Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8720531 | Electronic device cooling apparatus | Tomotaka Ishida, Mitsuru Yamamoto, Kazuo Taga, Kazuhiro Kumakura | 2014-05-13 |
| 8308453 | Diaphragm pump | Mitsuru Yamamoto, Kazuhito Murata | 2012-11-13 |
| 8081460 | Liquid-cooled heat radiator | Tomotaka Ishida, Mitsuru Yamamoto, Kazuhiro Kumakura | 2011-12-20 |
| 7826225 | Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator | Yoshinori Katada, Kazuo Taga, Tomotaka Ishida | 2010-11-02 |
| 7594644 | Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus | Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Masahiro Kubo, Yoshimichi Sogawa +1 more | 2009-09-29 |
| 7564164 | Drive circuit for piezoelectric pump and cooling system that uses this drive circuit | Mitsuru Yamamoto, Sunao Hamamura, Yasuhiro Sasaki | 2009-07-21 |
| 7483261 | Cooling device for an electronic equipment | Kazuyuki Mikubo, Atsushi Ochi, Mitsuru Yamamoto | 2009-01-27 |
| 7420807 | Cooling device for electronic apparatus | Kazuyuki Mikubo, Yasuhiro Sasaki, Atsushi Ochi, Mitsuru Yamamoto | 2008-09-02 |
| 7352069 | Electronic component unit | Ichiro Hazeyama, Masahiro Kubo, Koji Matsui, Kazumasa Igarashi, Hiroshi Noro | 2008-04-01 |
| 7242828 | Optical circuit in which fabrication is easy | Mikio Oda, Koji Soejima | 2007-07-10 |
| 7230328 | Semiconductor package and laminated semiconductor package | Ichiro Hazeyama, Yoshimichi Sogawa, Takao Yamazaki | 2007-06-12 |
| 7119438 | Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device | Ichiro Hazeyama, Masahiro Kubo, Kazuhiko Futakami, Shinichi Ishiduka, Susumu Nanko +3 more | 2006-10-10 |
| 7106426 | Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk | Hideo Kikuchi, Mikio Oda, Hikaru Kouta, Yuzo Shimada, Yoshio Matsumoto +1 more | 2006-09-12 |
| 6999643 | Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board | Hideo Kikuchi, Mikio Oda, Hikaru Kouta, Yuzo Shimada | 2006-02-14 |
| 6998704 | Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus | Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Masahiro Kubo, Yoshimichi Sogawa +1 more | 2006-02-14 |
| 6934429 | Optical waveguide board and optical module | Hideo Kikuchi, Junichi Sasaki, Seiji Suda, Mikio Oda, Hikaru Kouta +1 more | 2005-08-23 |
| 6926188 | Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip | Ichiro Hazeyama, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima +1 more | 2005-08-09 |
| 6889886 | Transfer apparatus for arraying small conductive bumps on substrate and/ or chip | Ichiro Hazeyama, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima +1 more | 2005-05-10 |
| 6829079 | Optical path control apparatus with mirror section, and manufacturing method for the same | Mikio Oda, Mitsuru Yamamoto, Hikaru Kouta, Yasuhiro Sasaki, Yuzo Shimada | 2004-12-07 |
| 6674016 | Electronic component | Masahiro Kubo, Ichiro Hazeyama, Koji Matsui, Kazumasa Igarashi | 2004-01-06 |
| 6670208 | Optical circuit in which fabrication is easy | Mikio Oda, Koji Soejima | 2003-12-30 |
| 6670699 | Semiconductor device packaging structure | Kazuyuki Mikubo, Yuzo Shimada | 2003-12-30 |
| 6611057 | Semiconductor device attaining both high speed processing and sufficient cooling capacity | Kazuyuki Mikubo | 2003-08-26 |
| 6477284 | Photo-electric combined substrate, optical waveguide and manufacturing process therefor | Mikio Oda, Yuzo Shimada, Masataka Itoh, Yoshinobu Kaneyama, Masahiko Fujiwara | 2002-11-05 |
| 6438504 | Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins | Kazuyuki Mikubo | 2002-08-20 |