| 8720531 |
Electronic device cooling apparatus |
Tomotaka Ishida, Mitsuru Yamamoto, Kazuo Taga, Kazuhiro Kumakura |
2014-05-13 |
|
| 8308453 |
Diaphragm pump |
Mitsuru Yamamoto, Kazuhito Murata |
2012-11-13 |
|
| 8081460 |
Liquid-cooled heat radiator |
Tomotaka Ishida, Mitsuru Yamamoto, Kazuhiro Kumakura |
2011-12-20 |
|
| 7826225 |
Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator |
Yoshinori Katada, Kazuo Taga, Tomotaka Ishida |
2010-11-02 |
$262,000 |
| 7594644 |
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Masahiro Kubo, Yoshimichi Sogawa +1 more |
2009-09-29 |
|
| 7564164 |
Drive circuit for piezoelectric pump and cooling system that uses this drive circuit |
Mitsuru Yamamoto, Sunao Hamamura, Yasuhiro Sasaki |
2009-07-21 |
|
| 7483261 |
Cooling device for an electronic equipment |
Kazuyuki Mikubo, Atsushi Ochi, Mitsuru Yamamoto |
2009-01-27 |
|
| 7420807 |
Cooling device for electronic apparatus |
Kazuyuki Mikubo, Yasuhiro Sasaki, Atsushi Ochi, Mitsuru Yamamoto |
2008-09-02 |
|
| 7352069 |
Electronic component unit |
Ichiro Hazeyama, Masahiro Kubo, Koji Matsui, Kazumasa Igarashi, Hiroshi Noro |
2008-04-01 |
|
| 7242828 |
Optical circuit in which fabrication is easy |
Mikio Oda, Koji Soejima |
2007-07-10 |
$40,000 |
| 7230328 |
Semiconductor package and laminated semiconductor package |
Ichiro Hazeyama, Yoshimichi Sogawa, Takao Yamazaki |
2007-06-12 |
$42,000 |
| 7119438 |
Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device |
Ichiro Hazeyama, Masahiro Kubo, Kazuhiko Futakami, Shinichi Ishiduka, Susumu Nanko +3 more |
2006-10-10 |
$16,000 |
| 7106426 |
Method of inspecting optical waveguide substrate for optical conduction at increased speed and also inspecting optical waveguide substrate for crosstalk |
Hideo Kikuchi, Mikio Oda, Hikaru Kouta, Yuzo Shimada, Yoshio Matsumoto +1 more |
2006-09-12 |
$25,000 |
| 6999643 |
Method of manufacturing optical waveguide and method of manufacturing opto-electric wiring board |
Hideo Kikuchi, Mikio Oda, Hikaru Kouta, Yuzo Shimada |
2006-02-14 |
$24,000 |
| 6998704 |
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus |
Takao Yamazaki, Hirobumi Inoue, Ichiro Hazeyama, Masahiro Kubo, Yoshimichi Sogawa +1 more |
2006-02-14 |
$24,000 |
| 6934429 |
Optical waveguide board and optical module |
Hideo Kikuchi, Junichi Sasaki, Seiji Suda, Mikio Oda, Hikaru Kouta +1 more |
2005-08-23 |
$22,000 |
| 6926188 |
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip |
Ichiro Hazeyama, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima +1 more |
2005-08-09 |
$21,000 |
| 6889886 |
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip |
Ichiro Hazeyama, Yuzo Shimada, Akeo Katahira, Jun Ishida, Masaru Terashima +1 more |
2005-05-10 |
$24,000 |
| 6829079 |
Optical path control apparatus with mirror section, and manufacturing method for the same |
Mikio Oda, Mitsuru Yamamoto, Hikaru Kouta, Yasuhiro Sasaki, Yuzo Shimada |
2004-12-07 |
$41,000 |
| 6674016 |
Electronic component |
Masahiro Kubo, Ichiro Hazeyama, Koji Matsui, Kazumasa Igarashi |
2004-01-06 |
$32,000 |
| 6670208 |
Optical circuit in which fabrication is easy |
Mikio Oda, Koji Soejima |
2003-12-30 |
$21,000 |
| 6670699 |
Semiconductor device packaging structure |
Kazuyuki Mikubo, Yuzo Shimada |
2003-12-30 |
$21,000 |
| 6611057 |
Semiconductor device attaining both high speed processing and sufficient cooling capacity |
Kazuyuki Mikubo |
2003-08-26 |
$39,000 |
| 6477284 |
Photo-electric combined substrate, optical waveguide and manufacturing process therefor |
Mikio Oda, Yuzo Shimada, Masataka Itoh, Yoshinobu Kaneyama, Masahiko Fujiwara |
2002-11-05 |
$9,000 |
| 6438504 |
Method of calculating thermal resistance in semiconductor package accommodating semiconductor chip within a case which can be applied to calculation for semiconductor package with radiation fins |
Kazuyuki Mikubo |
2002-08-20 |
$10,000 |
