Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
KS

Koji Soejima — 48 Patents

RERenesas Electronics: 26 patents #62 of 4,529Top 2%
Nec: 17 patents #646 of 14,502Top 5%
NENec Electronics: 12 patents #34 of 1,789Top 2%
KOKomatsu: 2 patents #861 of 2,087Top 45%
Overall (All Time): #57,596 of 4,157,543Top 2%
48 Patents All Time
Koji Soejima has been granted 48 US patents while listed as an inventor at Renesas Electronics. The first was granted in 1999 and the most recent in August 2024. Koji Soejima ranks #57,596 of 4,157,543 US inventors in our database (top 1.4%). Patent records list Koji Soejima in Yokohama, MO, JP.

Patents per Year

Patents granted per year, 1999 to 2024Bar chart with a peak of 10 patents in 2011.peak 101999: 1 patents19992000: 2 patents2001: 2 patents20012003: 2 patents2007: 2 patents20072008: 1 patents2009: 5 patents20092010: 5 patents2011: 10 patents20112012: 4 patents2013: 3 patents20132014: 3 patents2015: 1 patents20152016: 1 patents2017: 1 patents20172018: 1 patents2019: 1 patents20192020: 2 patents2024: 1 patents2024

Issued Patents All Time

Showing 1–25 of 48 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12054910 Work vehicle 2024-08-06
10879227 Electronic device Yoichiro Kurita, Masaya Kawano 2020-12-29
10580763 Electronic device Yoichiro Kurita, Masaya Kawano 2020-03-03
10224318 Electronic device Yoichiro Kurita, Masaya Kawano 2019-03-05
9863122 Cooling device and construction machine Yushi Tanaka, Yuuki Ishikawa 2018-01-09
9847325 Electronic device Yoichiro Kurita, Masaya Kawano 2017-12-19
9406602 Electronic device Yoichiro Kurita, Masaya Kawano 2016-08-02
8975750 Electronic device Yoichiro Kurita, Masaya Kawano 2015-03-10
8823174 Electronic device Yoichiro Kurita, Masaya Kawano 2014-09-02
8685796 Electronic device and method of manufacturing the same Yoichiro Kurita, Masaya Kawano 2014-04-01
8633591 Electronic device Yoichiro Kurita, Masaya Kawano 2014-01-21
8456019 Semiconductor device Masaya Kawano, Nobuaki Takahashi 2013-06-04
8395269 Method of stacking semiconductor chips including forming an interconnect member and a through electrode Masaya Kawano, Nobuaki Takahashi, Yoichiro Kurita, Masahiro Komuro, Satoshi Matsui 2013-03-12
8354340 Electronic device and method of manufacturing the same Yoichiro Kurita, Masaya Kawano 2013-01-15
8304915 Semiconductor device and method for manufacturing the same Kentaro Mori, Hideya Murai, Shintaro Yamamichi, Masaya Kawano 2012-11-06
8183685 Semiconductor device Masaya Kawano, Nobuaki Takahashi 2012-05-22
8114766 Method for manufacturing semiconductor device Yoichiro Kurita, Masaya Kawano 2012-02-14
8102049 Semiconductor device including through electrode and method of manufacturing the same Nobuaki Takahashi, Masahiro Komuro, Satoshi Matsui, Masaya Kawano 2012-01-24
8058165 Semiconductor device and method of manufacturing the same Masaya Kawano, Yoichiro Kurita 2011-11-15
8050050 Wiring board, semiconductor device, and method of manufacturing the same Shintaro Yamamichi, Katsumi Kikuchi, Yoichiro Kurita 2011-11-01
8039756 Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same Katsumi Kikuchi, Shintaro Yamamichi, Yoichiro Kurita 2011-10-18
8035231 Semiconductor device and method of manufacturing the same Yoichiro Kurita, Masaya Kawano 2011-10-11
8030201 Semiconductor device and method of manufacturing the same Yoichiro Kurita, Masaya Kawano, Shintaro Yamamichi, Katsumi Kikuchi 2011-10-04
7928001 Electronic device and method of manufacturing the same Yoichiro Kurita, Masaya Kawano 2011-04-19
7927999 Method of forming metal interconnect layers for flip chip device Yoichiro Kurita, Masaya Kawano 2011-04-19