| 12054910 |
Work vehicle |
— |
2024-08-06 |
|
| 10879227 |
Electronic device |
Yoichiro Kurita, Masaya Kawano |
2020-12-29 |
|
| 10580763 |
Electronic device |
Yoichiro Kurita, Masaya Kawano |
2020-03-03 |
|
| 10224318 |
Electronic device |
Yoichiro Kurita, Masaya Kawano |
2019-03-05 |
|
| 9863122 |
Cooling device and construction machine |
Yushi Tanaka, Yuuki Ishikawa |
2018-01-09 |
|
| 9847325 |
Electronic device |
Yoichiro Kurita, Masaya Kawano |
2017-12-19 |
|
| 9406602 |
Electronic device |
Yoichiro Kurita, Masaya Kawano |
2016-08-02 |
|
| 8975750 |
Electronic device |
Yoichiro Kurita, Masaya Kawano |
2015-03-10 |
|
| 8823174 |
Electronic device |
Yoichiro Kurita, Masaya Kawano |
2014-09-02 |
|
| 8685796 |
Electronic device and method of manufacturing the same |
Yoichiro Kurita, Masaya Kawano |
2014-04-01 |
|
| 8633591 |
Electronic device |
Yoichiro Kurita, Masaya Kawano |
2014-01-21 |
|
| 8456019 |
Semiconductor device |
Masaya Kawano, Nobuaki Takahashi |
2013-06-04 |
|
| 8395269 |
Method of stacking semiconductor chips including forming an interconnect member and a through electrode |
Masaya Kawano, Nobuaki Takahashi, Yoichiro Kurita, Masahiro Komuro, Satoshi Matsui |
2013-03-12 |
|
| 8354340 |
Electronic device and method of manufacturing the same |
Yoichiro Kurita, Masaya Kawano |
2013-01-15 |
|
| 8304915 |
Semiconductor device and method for manufacturing the same |
Kentaro Mori, Hideya Murai, Shintaro Yamamichi, Masaya Kawano |
2012-11-06 |
|
| 8183685 |
Semiconductor device |
Masaya Kawano, Nobuaki Takahashi |
2012-05-22 |
|
| 8114766 |
Method for manufacturing semiconductor device |
Yoichiro Kurita, Masaya Kawano |
2012-02-14 |
|
| 8102049 |
Semiconductor device including through electrode and method of manufacturing the same |
Nobuaki Takahashi, Masahiro Komuro, Satoshi Matsui, Masaya Kawano |
2012-01-24 |
|
| 8058165 |
Semiconductor device and method of manufacturing the same |
Masaya Kawano, Yoichiro Kurita |
2011-11-15 |
|
| 8050050 |
Wiring board, semiconductor device, and method of manufacturing the same |
Shintaro Yamamichi, Katsumi Kikuchi, Yoichiro Kurita |
2011-11-01 |
|
| 8039756 |
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same |
Katsumi Kikuchi, Shintaro Yamamichi, Yoichiro Kurita |
2011-10-18 |
|
| 8035231 |
Semiconductor device and method of manufacturing the same |
Yoichiro Kurita, Masaya Kawano |
2011-10-11 |
|
| 8030201 |
Semiconductor device and method of manufacturing the same |
Yoichiro Kurita, Masaya Kawano, Shintaro Yamamichi, Katsumi Kikuchi |
2011-10-04 |
|
| 7928001 |
Electronic device and method of manufacturing the same |
Yoichiro Kurita, Masaya Kawano |
2011-04-19 |
|
| 7927999 |
Method of forming metal interconnect layers for flip chip device |
Yoichiro Kurita, Masaya Kawano |
2011-04-19 |
|
