Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7892973 | Method for manufacturing a semiconductor device | Masaya Kawano, Nobuaki Takahashi | 2011-02-22 |
| 7889514 | Wiring board, semiconductor device, and method of manufacturing the same | Shintaro Yamamichi, Katsumi Kikuchi, Yoichiro Kurita | 2011-02-15 |
| 7880295 | Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same | Katsumi Kikuchi, Shintaro Yamamichi, Yoichiro Kurita | 2011-02-01 |
| 7800233 | Semiconductor device and method of manufacturing the same | Masaya Kawano, Yoichiro Kurita | 2010-09-21 |
| 7791186 | Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same | Katsumi Kikuchi, Shintaro Yamamichi, Yoichiro Kurita | 2010-09-07 |
| 7759786 | Electronic circuit chip, and electronic circuit device and method for manufacturing the same | Yoichiro Kurita, Masaya Kawano | 2010-07-20 |
| 7656046 | Semiconductor device | Yoichiro Kurita, Masaya Kawano | 2010-02-02 |
| 7652375 | Semiconductor device and method of manufacturing the same | Yoichiro Kurita, Masaya Kawano, Shintaro Yamamichi, Katsumi Kikuchi | 2010-01-26 |
| 7633167 | Semiconductor device and method for manufacturing same | Masaya Kawano, Nobuaki Takahashi | 2009-12-15 |
| 7598117 | Method for manufacturing semiconductor module using interconnection structure | Yoichiro Kurita, Masaya Kawano | 2009-10-06 |
| 7538022 | Method of manufacturing electronic circuit device | Yoichiro Kurita, Masaya Kawano | 2009-05-26 |
| 7528068 | Method for manufacturing semiconductor device | Masaya Kawano | 2009-05-05 |
| 7495345 | Semiconductor device-composing substrate and semiconductor device | Yoichiro Kurita, Masaya Kawano | 2009-02-24 |
| 7348673 | Semiconductor device | Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Hirokazu Honda, Shinichi Miyazaki | 2008-03-25 |
| 7242828 | Optical circuit in which fabrication is easy | Mikio Oda, Sakae Kitajo | 2007-07-10 |
| 7202108 | Semiconductor wafer, semiconductor chip and method for manufacturing the same | — | 2007-04-10 |
| 6670208 | Optical circuit in which fabrication is easy | Mikio Oda, Sakae Kitajo | 2003-12-30 |
| 6625883 | Method for making a bump structure | Naoji Senba | 2003-09-30 |
| 6307159 | Bump structure and method for making the same | Naoji Senba | 2001-10-23 |
| 6307392 | Probe card and method of forming a probe card | Naoji Senba | 2001-10-23 |
| 6114864 | Probe card with plural probe tips on a unitary flexible tongue | Naoji Senba | 2000-09-05 |
| 6096259 | Fabrication method of plastic-molded lead component | Nobuaki Takahashi, Naoji Senba, Yuzo Shimada | 2000-08-01 |
| 5936845 | IC package and IC probe card with organic substrate | Nobuaki Takahashi, Naoji Senba, Yuzo Shimada | 1999-08-10 |