Issued Patents All Time
Showing 1–25 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166008 | Injection molded solder head with improved sealing performance | Sayuri Hada, Toyohiro Aoki, Takashi Hisada | 2024-12-10 |
| 10098179 | Electronic device | Hirokazu Honda, Masaki Watanabe, Junichi Arita, Norio Okada, Jun UENO +3 more | 2018-10-09 |
| 9520375 | Method of forming a solder bump on a substrate | Toyohiro Aoki, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama | 2016-12-13 |
| 9362262 | Semiconductor device | Manabu Okamoto, Hirokazu Honda | 2016-06-07 |
| 9362263 | Semiconductor device | Kenta Ogawa | 2016-06-07 |
| 9324663 | Semiconductor device including a plurality of magnetic shields | Takahito Watanabe, Yoshitaka Ushiyama | 2016-04-26 |
| 9172028 | Semiconductor device | Takahito Watanabe | 2015-10-27 |
| 9165879 | Semiconductor device | Kenta Ogawa | 2015-10-20 |
| 9117814 | Semiconductor device | Manabu Okamoto, Hirokazu Honda | 2015-08-25 |
| 8975150 | Semiconductor device manufacturing method | Kentaro Mori, Hideya Murai, Takuo Funaya, Masaya Kawano, Takehiko Maeda +1 more | 2015-03-10 |
| 8929090 | Functional element built-in substrate and wiring substrate | Yoshiki Nakashima, Katsumi Kikuchi, Kentaro Mori, Hideya Murai | 2015-01-06 |
| 8872334 | Method for manufacturing semiconductor device | Katsumi Kikuchi, Yoshiki Nakashima, Kentaro Mori | 2014-10-28 |
| 8815678 | Method for fabricating a metal-insulator-metal (MIM) capacitor having capacitor dielectric layer formed by atomic layer deposition (ALD) | Toshihiro Iizuka, Tomoe Yamamoto, Mami Toda | 2014-08-26 |
| 8810008 | Semiconductor element-embedded substrate, and method of manufacturing the substrate | Kentaro Mori, Hideya Murai, Katsumi Kikuchi, Yoshiki Nakashima, Daisuke Ohshima | 2014-08-19 |
| 8766440 | Wiring board with built-in semiconductor element | Katsumi Kikuchi, Hideya Murai, Kentaro Mori, Yoshiki Nakashima, Daisuke Ohshima | 2014-07-01 |
| 8749033 | Semiconductor device and method of manufacturing semiconductor device | Takahito Watanabe, Yoshitaka Ushiyama | 2014-06-10 |
| 8710669 | Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer | Kentaro Mori, Yoshiki Nakashima, Daisuke Ohshima, Katsumi Kikuchi | 2014-04-29 |
| 8710639 | Semiconductor element-embedded wiring substrate | Katsumi Kikuchi, Hideya Murai, Kentaro Mori, Yoshiki Nakashima | 2014-04-29 |
| 8692364 | Semiconductor device and method for manufacturing the same | Katsumi Kikuchi, Yoshiki Nakashima, Kentaro Mori | 2014-04-08 |
| 8692135 | Wiring board capable of containing functional element and method for manufacturing same | Takuo Funaya, Daisuke Ohshima, Yoshiki Nakashima | 2014-04-08 |
| 8569892 | Semiconductor device and manufacturing method thereof | Kentaro Mori, Daisuke Ohshima, Hideya Murai, Katsumi Maeda, Katsumi Kikuchi +1 more | 2013-10-29 |
| 8552570 | Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device | Katsumi Kikuchi, Masaya Kawano, Kouji Soejima, Yoichiro Kurita | 2013-10-08 |
| 8536691 | Semiconductor device and method for manufacturing the same | Katsumi Kikuchi, Hideya Murai, Katsumi Maeda, Takuo Funaya, Kentaro Mori +3 more | 2013-09-17 |
| 8389414 | Method of manufacturing a wiring board | Katsumi Kikuchi, Hideya Murai, Takuo Funaya, Kentaro Mori, Takehiko Maeda +3 more | 2013-03-05 |
| 8344498 | Semiconductor device | Kentaro Mori, Hideya Murai | 2013-01-01 |