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2018-02-06 |
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Semiconductor element-embedded substrate, and method of manufacturing the substrate |
Kentaro Mori, Shintaro Yamamichi, Hideya Murai, Katsumi Kikuchi, Yoshiki Nakashima |
2014-08-19 |
| 8766440 |
Wiring board with built-in semiconductor element |
Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Kentaro Mori, Yoshiki Nakashima |
2014-07-01 |
| 8710669 |
Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer |
Kentaro Mori, Yoshiki Nakashima, Katsumi Kikuchi, Shintaro Yamamichi |
2014-04-29 |
| 8692135 |
Wiring board capable of containing functional element and method for manufacturing same |
Takuo Funaya, Shintaro Yamamichi, Yoshiki Nakashima |
2014-04-08 |
| 8569892 |
Semiconductor device and manufacturing method thereof |
Kentaro Mori, Shintaro Yamamichi, Hideya Murai, Katsumi Maeda, Katsumi Kikuchi +1 more |
2013-10-29 |
| 8450843 |
Semiconductor device and method for designing the same |
Hideki Sasaki, Takuo Funaya |
2013-05-28 |
| 7434190 |
Analysis method and analysis apparatus of designing transmission lines of an integrated circuit packaging board |
Hirobumi Inoue, Jun Sakai, Mitsuru Furuya |
2008-10-07 |