Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270971 | Semiconductor device and method of manufacturing the same | Kenji Ikura, Hideki Ishii, Takeumi KATO | 2022-03-08 |
| 10895373 | Light projection device | — | 2021-01-19 |
| 10181450 | Method of manufacturing semiconductor device | Seiya Isozaki, Takashi Moriyama | 2019-01-15 |
| 9853005 | Semiconductor device and method of manufacturing the same | Akira Yajima, Satoshi Itou, Fumiyoshi Kawashiro | 2017-12-26 |
| 9659888 | Semiconductor device | Makio Okada | 2017-05-23 |
| 9299632 | Semiconductor device | Makio Okada | 2016-03-29 |
| 8975150 | Semiconductor device manufacturing method | Kentaro Mori, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Masaya Kawano +1 more | 2015-03-10 |
| 8536691 | Semiconductor device and method for manufacturing the same | Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Katsumi Maeda, Takuo Funaya +3 more | 2013-09-17 |
| 8389414 | Method of manufacturing a wiring board | Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori +3 more | 2013-03-05 |
| 8043953 | Semiconductor device including an LSI chip and a method for manufacturing the same | Hideya Murai, Yuji Kayashima, Shintaro Yamamichi, Takuo Funaya | 2011-10-25 |
| 8035217 | Semiconductor device and method for manufacturing same | Kentaro Mori, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Masaya Kawano +1 more | 2011-10-11 |
| 7999401 | Semiconductor device and method of manufacturing same | Hideya Murai, Kentaro Mori, Shintaro Yamamichi, Masaya Kawano, Kouji Soejima | 2011-08-16 |
| 7911038 | Wiring board, semiconductor device using wiring board and their manufacturing methods | Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Kentaro Mori +3 more | 2011-03-22 |
| 7838779 | Wiring board, method for manufacturing same, and semiconductor package | Shintaro Yamamichi, Katsumi Kikuchi, Hideya Murai, Takuo Funaya, Kenta Ogawa +2 more | 2010-11-23 |
| 7745736 | Interconnecting substrate and semiconductor device | Kenta Ogawa, Jun Tsukano, Tadanori Shimoto, Shintaro Yamamichi, Kazuhiro Baba | 2010-06-29 |
| 7701726 | Method of manufacturing a wiring substrate and semiconductor device | Jun Tsukano, Kenta Ogawa, Shintaro Yamamichi, Katsumi Kikuchi | 2010-04-20 |
| 7674989 | Wiring board and method for manufacturing the same | Katsumi Kikuchi, Shintaro Yamamichi, Hideya Murai, Takuo Funaya, Hirokazu Honda +2 more | 2010-03-09 |
| 7649749 | Wiring substrate, semiconductor device, and method of manufacturing the same | Jun Tsukano, Kenta Ogawa, Shintaro Yamamichi, Katsumi Kikuchi | 2010-01-19 |
| 6762488 | Light thin stacked package semiconductor device and process for fabrication thereof | Jun Tsukano | 2004-07-13 |