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Electronic circuit connection method and electronic circuit |
Masaru Hashino, Ying Ying Lim, Hiroshi Nakagawa, Katsuya Kikuchi |
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Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof |
Tung Thanh Bui, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi |
2018-05-29 |
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Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof |
Tung Thanh Bui, Naoya Watanabe, Katsuya Kikuchi, Wei Feng |
2017-11-14 |
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Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus |
Thanh Tung Bui, Motohiro Suzuki, Naoya Watanabe, Fumiki Kato, Lai Na Ma +1 more |
2017-04-18 |
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Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same |
Ryota Iwai, Tomoaki Tokuhisa, Masaru Kato, Tokihiko Yokoshima, Yasuhiro Yamaji +2 more |
2016-05-17 |
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Method of making contact probe |
Katsuya Kikuchi, Hiroshi Nakagawa, Yoshikuni Okada, Hiroyuki Fujita, Shouichi Imai +1 more |
2015-09-15 |
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Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same |
Yasuhiro Yamaji, Tokihiko Yokoshima, Hiroshi Nakagawa, Katsuya Kikuchi |
2013-03-19 |
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Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same |
Yasuhiro Yamaji, Tokihiko Yokoshima, Hiroshi Nakagawa, Katsuya Kikuchi |
2013-02-05 |
| 7990165 |
Contact probe and method of making the same |
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2011-08-02 |
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Multi-layer fin wiring interposer fabrication process |
Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada |
2010-11-16 |
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Method of forming micro metal bump |
Yoshihiro Gomi, Hiroshi Nakagawa, Katsuya Kikuchi, Yoshikuni Okada, Hirotaka Oosato |
2010-08-03 |
| 7414422 |
System in-package test inspection apparatus and test inspection method |
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2008-08-19 |
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Superconducting integrated circuit and method for fabrication thereof |
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2008-01-29 |
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Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device |
Aki Nakajo, Hirofumi Tsuchiyama, Shinobu Nakamura |
2007-06-26 |
| 7227352 |
Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe |
Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota |
2007-06-05 |
| 7208966 |
Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe |
Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota |
2007-04-24 |
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Superconducting integrated circuit and method for fabrication thereof |
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2005-06-28 |
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Elementary cell for constructing asynchronous superconducting logic circuits |
Itaru Kurosawa, Hiroshi Nakagawa, Masaaki Maezawa, Takashi Nanya, Yoshio Kameda |
1997-01-28 |
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Josephson memory circuit |
Itaru Kurosawa, Hiroshi Nakagawa |
1993-11-09 |