Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270968 | Electronic circuit connection method and electronic circuit | Masaru Hashino, Ying Ying Lim, Hiroshi Nakagawa, Katsuya Kikuchi | 2022-03-08 |
| 9984956 | Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof | Tung Thanh Bui, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi | 2018-05-29 |
| 9818645 | Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof | Tung Thanh Bui, Naoya Watanabe, Katsuya Kikuchi, Wei Feng | 2017-11-14 |
| 9627347 | Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus | Thanh Tung Bui, Motohiro Suzuki, Naoya Watanabe, Fumiki Kato, Lai Na Ma +1 more | 2017-04-18 |
| 9345145 | Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same | Ryota Iwai, Tomoaki Tokuhisa, Masaru Kato, Tokihiko Yokoshima, Yasuhiro Yamaji +2 more | 2016-05-17 |
| 9134346 | Method of making contact probe | Katsuya Kikuchi, Hiroshi Nakagawa, Yoshikuni Okada, Hiroyuki Fujita, Shouichi Imai +1 more | 2015-09-15 |
| 8399979 | Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same | Yasuhiro Yamaji, Tokihiko Yokoshima, Hiroshi Nakagawa, Katsuya Kikuchi | 2013-03-19 |
| 8367468 | Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same | Yasuhiro Yamaji, Tokihiko Yokoshima, Hiroshi Nakagawa, Katsuya Kikuchi | 2013-02-05 |
| 7990165 | Contact probe and method of making the same | Katsuya Kikuchi, Hiroshi Nakagawa, Yoshikuni Okada, Hiroyuki Fujita, Shoichi Imai +1 more | 2011-08-02 |
| 7833835 | Multi-layer fin wiring interposer fabrication process | Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada | 2010-11-16 |
| 7767574 | Method of forming micro metal bump | Yoshihiro Gomi, Hiroshi Nakagawa, Katsuya Kikuchi, Yoshikuni Okada, Hirotaka Oosato | 2010-08-03 |
| 7414422 | System in-package test inspection apparatus and test inspection method | Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Hiroyuki Fujita +1 more | 2008-08-19 |
| 7323348 | Superconducting integrated circuit and method for fabrication thereof | Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Hiroshi Itatani, Sigemasa Segawa | 2008-01-29 |
| 7234998 | Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device | Aki Nakajo, Hirofumi Tsuchiyama, Shinobu Nakamura | 2007-06-26 |
| 7227352 | Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe | Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota | 2007-06-05 |
| 7208966 | Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe | Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota | 2007-04-24 |
| 6911665 | Superconducting integrated circuit and method for fabrication thereof | Hiroshi Nakagawa, Kazuhiko Tokoro, Katsuya Kikuchi, Hiroshi Itatani, Sigemasa Segawa | 2005-06-28 |
| 5598105 | Elementary cell for constructing asynchronous superconducting logic circuits | Itaru Kurosawa, Hiroshi Nakagawa, Masaaki Maezawa, Takashi Nanya, Yoshio Kameda | 1997-01-28 |
| 5260264 | Josephson memory circuit | Itaru Kurosawa, Hiroshi Nakagawa | 1993-11-09 |