Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7833835 | Multi-layer fin wiring interposer fabrication process | Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi, Yoshikuni Okada | 2010-11-16 |
| 7414422 | System in-package test inspection apparatus and test inspection method | Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi, Yoshikuni Okada, Hiroyuki Fujita +1 more | 2008-08-19 |
| 7323348 | Superconducting integrated circuit and method for fabrication thereof | Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi, Hiroshi Itatani, Sigemasa Segawa | 2008-01-29 |
| 7227352 | Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe | Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota | 2007-06-05 |
| 7208966 | Contact probe, measuring pad used for the contact probe, and method of manufacturing the contact probe | Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi, Yoshikuni Okada, Shigeo Kiyota | 2007-04-24 |
| 6911665 | Superconducting integrated circuit and method for fabrication thereof | Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi, Hiroshi Itatani, Sigemasa Segawa | 2005-06-28 |