Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9345145 | Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same | Ryota Iwai, Tomoaki Tokuhisa, Masaru Kato, Tokihiko Yokoshima, Masahiro Aoyagi +2 more | 2016-05-17 |
| 8399979 | Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same | Tokihiko Yokoshima, Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi | 2013-03-19 |
| 8367468 | Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same | Tokihiko Yokoshima, Masahiro Aoyagi, Hiroshi Nakagawa, Katsuya Kikuchi | 2013-02-05 |
| 7015572 | Three-dimensionally mounted semiconductor module and three-dimensionally mounted semiconductor system | — | 2006-03-21 |
| 6707160 | Semiconductor device using substrate having cubic structure and method of manufacturing the same | — | 2004-03-16 |
| 6171887 | Semiconductor device for a face down bonding to a mounting substrate and a method of manufacturing the same | — | 2001-01-09 |
| 6159837 | Manufacturing method of semiconductor device | Eiichi Hosomi | 2000-12-12 |
| 5925936 | Semiconductor device for face down bonding to a mounting substrate and a method of manufacturing the same | — | 1999-07-20 |
| 5567983 | Semiconductor apparatus capable of cooling a semiconductor element with radiation efficiency | Naohiko Hirano | 1996-10-22 |
| 5548161 | Semiconductor apparatus capable of cooling a semiconductor element with low radiation efficiency | Naohiko Hirano | 1996-08-20 |
| 5536973 | Semiconductor device including a semiconductor element mounted on a substrate using bump-shaped connecting electrodes | — | 1996-07-16 |
| 5461197 | Electronic device having a chip with an external bump terminal equal or smaller than a via hole on a board | Yoichi Hiruta | 1995-10-24 |
| 5401688 | Semiconductor device of multichip module-type | Yoichi Hiruta, Tsutomu Nakazawa, Katsuto Katoh, Yoshihiro Atsumi, Naohiko Hirano +1 more | 1995-03-28 |
| 5394303 | Semiconductor device | — | 1995-02-28 |
| 5198883 | Semiconductor device having an improved lead arrangement and method for manufacturing the same | Kenji Takahashi, Susumu Harada, Kazuichi Komenaka, Mitsugu Miyamoto, Masashi Muromachi +4 more | 1993-03-30 |
| 4855807 | Semiconductor device | Kenji Takahashi, Seiichi Hirata, Toshiharu Sakurai | 1989-08-08 |