TN

Tsutomu Nakazawa

KT Kabushiki Kaisha Toshiba: 7 patents #4,294 of 21,451Top 25%
SC Sanyo Electric Co.: 6 patents #961 of 6,347Top 20%
Fujitsu Limited: 3 patents #8,614 of 24,456Top 40%
AC Arisawa Mfg. Co.: 1 patents #49 of 105Top 50%
SO Sony: 1 patents #17,262 of 25,231Top 70%
📍 Joetsu, JP: #58 of 239 inventorsTop 25%
Overall (All Time): #279,292 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
7255274 Data exchanging system, device, and method, all utilizing IC chip 2007-08-14
7202787 Non-authentic article discrimination system, and method for discriminating non-authentic article 2007-04-10
7143948 Reading method of the two-dimensional bar code Kouichi Hamakawa, Youji Takei, Masanobu Kiyama 2006-12-05
7106902 Personal authentication system and method thereof Kouichi Hamakawa, Youji Takei, Masanobu Kiyama 2006-09-12
6297746 Centralized apparatus control system for controlling a plurality of electrical apparatuses Osamu Ishikawa, Kouichi Hamakawa, Ryouichi Watanabe, Takao Suzuki 2001-10-02
5757066 Resin-molded type semiconductor device and method of manufacturing the same Yumi Inoue 1998-05-26
5733802 Semiconductor device and method of manufacturing the same Yumi Inoue 1998-03-31
5684327 Lead frame for use in a resin-sealed type semiconductor device Yumi Inoue 1997-11-04
5648682 Resin-sealed semiconductor device and lead frame used in a resin-sealed semiconductor device Yumi Inoue 1997-07-15
5518937 Semiconductor device having a region doped to a level exceeding the solubility limit Yuji Furumura, Fumitake Mieno, Takashi Eshita, Mamoru Maeda, Tsunenori Yamauchi 1996-05-21
5401688 Semiconductor device of multichip module-type Yasuhiro Yamaji, Yoichi Hiruta, Katsuto Katoh, Yoshihiro Atsumi, Naohiko Hirano +1 more 1995-03-28
5299010 Channel display device for receivable channels Hiroyasu Shindou, Masaru Tonozuka 1994-03-29
5270224 Method of manufacturing a semiconductor device having a region doped to a level exceeding the solubility limit Yuji Furumura, Fumitake Mieno, Takashi Eshita, Mamoru Maeda, Tsunenori Yamauchi 1993-12-14
5248895 Semiconductor apparatus having resin encapsulated tab tape connections 1993-09-28
5191403 Resin-sealed semiconductor device having a particular mold resin structure 1993-03-02
5111266 Semiconductor device having a region doped to a level exceeding the solubility limit Yuji Furumura, Fumitake Mieno, Takashi Eshita, Mamoru Maeda, Tsunenori Yamauchi 1992-05-05
4948537 Method of producing a resin mold for rear projection screen Akio Ohkoshi, Takuji Inoue, Eihachi Ogino 1990-08-14