Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9059143 | Semiconductor device | Yukari Imaizumi, Goshi Kawazu, Isao Kudo, Akio Katsumata | 2015-06-16 |
| 6182828 | Reel tape for provisionally supporting a bare chip | — | 2001-02-06 |
| 6111317 | Flip-chip connection type semiconductor integrated circuit device | Takashi Okada, Naohiko Hirano, Hiroshi Tazawa, Eiichi Hosomi, Chiaki Takubo +2 more | 2000-08-29 |
| 6094057 | Board for evaluating the characteristics of a semiconductor chip and a method for mounting a semiconductor chip thereon | Chiaki Takubo | 2000-07-25 |
| 5998861 | Semiconductor device having ball grid array | — | 1999-12-07 |
| 5952841 | Bare chip prober device | — | 1999-09-14 |
| 5801447 | Flip chip mounting type semiconductor device | Naohiko Hirano, Kazuhide Doi, Chiaki Takubo, Hiroshi Tazawa, Eiichi Hosomi +2 more | 1998-09-01 |
| 5648686 | Connecting electrode portion in semiconductor device | Naohiko Hirano, Kazuhide Doi, Masayuki Miura, Takashi Okada | 1997-07-15 |
| 5629566 | Flip-chip semiconductor devices having two encapsulants | Kazuhide Doi, Masayuki Miura, Takashi Okada, Naohiko Hirano | 1997-05-13 |
| 5533664 | Method of manufacturing a semiconductor device | Mamoru Sasaki, Chiaki Takubo | 1996-07-09 |
| 5477079 | Power source noise suppressing type semiconductor device | — | 1995-12-19 |
| 5463245 | Semiconductor integrated circuit device having sealing means | — | 1995-10-31 |
| 5461197 | Electronic device having a chip with an external bump terminal equal or smaller than a via hole on a board | Yasuhiro Yamaji | 1995-10-24 |
| 5424917 | Semiconductor device and method for mounting semiconductor wafer | — | 1995-06-13 |
| 5401688 | Semiconductor device of multichip module-type | Yasuhiro Yamaji, Tsutomu Nakazawa, Katsuto Katoh, Yoshihiro Atsumi, Naohiko Hirano +1 more | 1995-03-28 |
| 5179434 | Semiconductor device and manufacturing method thereof | — | 1993-01-12 |
| 5138433 | Multi-chip package type semiconductor device | — | 1992-08-11 |
| 4764478 | Method of manufacturing MOS transistor by dual species implantation and rapid annealing | — | 1988-08-16 |
| 4713356 | Manufacturing MOS semiconductor device with planarized conductive layer | — | 1987-12-15 |