Issued Patents All Time
Showing 1–25 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424542 | Semiconductor device | Kentaro Mori | 2019-09-24 |
| 9852995 | Semiconductor device | Kentaro Mori | 2017-12-26 |
| 9633902 | Method for manufacturing semiconductor device that includes dividing semiconductor substrate by dry etching | Satoshi Matsui, Mie Matsuo | 2017-04-25 |
| 9202768 | Semiconductor module | Hideo Aoki, Katsuhiko Oyama, Taku Nishiyama, Katsuya Sakai | 2015-12-01 |
| 9142477 | Semiconductor module | Hideo Aoki | 2015-09-22 |
| 8426977 | Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module | Kazumasa Tanida, Hideko Mukaida, Susumu Harada | 2013-04-23 |
| 8338904 | Semiconductor device and method for manufacturing the same | Kazumasa Tanida, Hideo Numata, Yoshihisa Imori | 2012-12-25 |
| 8309430 | Semiconductor manufacturing apparatus and semiconductor manufacturing method | Kazumasa Tanida, Naoko Yamaguchi, Satoshi Hongo, Hideo Numata | 2012-11-13 |
| 8237285 | Semiconductor device, through hole having expansion portion and thin insulating film | Kazumasa Tanida, Mie Matsuo, Masahiro Sekiguchi | 2012-08-07 |
| 8220147 | Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit | Naoko Yamaguchi, Hideo Aoki | 2012-07-17 |
| 7939171 | Metal-containing resin particle, metal-containing resin layer, method of forming metal-containing resin layer, and substrate for electronic circuit | Hideo Aoki, Naoko Yamaguchi | 2011-05-10 |
| 7932605 | Semiconductor device and manufacturing method therefor | Takashi Imoto | 2011-04-26 |
| 7888760 | Solid state imaging device and method for manufacturing same, and solid state imaging module | Hitoshi Sugiyama, Atsuko Yamashita, Kazutaka Akiyama, Susumu Harada, Masahiro Sekiguchi +4 more | 2011-02-15 |
| 7877871 | Method of manufacturing an electronic circuit formed on a substrate | Hideo Aoki, Naoko Yamaguchi, Toshiaki Yamauchi, Koji Imamiya, Hiroshi Hashizume | 2011-02-01 |
| 7608911 | Semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato, Tetsuya Kurosawa +1 more | 2009-10-27 |
| 7531876 | Semiconductor device having power semiconductor elements | Ichiro Omura, Kenji Takahashi, Hideo Aoki, Hideo Numata, Mie Matsuo +5 more | 2009-05-12 |
| 7486921 | Method of producing electronic circuit, and electronic circuit substrate | Naoko Yamaguchi, Hideo Aoki | 2009-02-03 |
| 7469941 | Method of producing a wiring board | Hideo Aoki, Naoko Yamaguchi | 2008-12-30 |
| 7438481 | Optical semiconductor module and semiconductor device including the same | Hideo Numata, Hideto Furuyama, Hiroshi Hamasaki | 2008-10-21 |
| 7433637 | Image forming apparatus and method of manufacturing electronic circuit using the same | Hideo Aoki, Naoko Yamaguchi, Toshiaki Yamauchi, Koji Imamiya, Hiroshi Hashizume | 2008-10-07 |
| 7414417 | Contact sheet for testing electronic parts, apparatus for testing electronic parts, method for testing electronic parts, method for manufacturing electronic parts and electronic parts | Naoko Yamaguchi, Hideo Aoki, Toshiro Hiraoka, Yasuyuki Hotta, Shigeru Matake | 2008-08-19 |
| 7405159 | Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface | Takashi Imoto, Ryuji Hosokawa, Yoshihisa Imori, Takao Sato, Tetsuya Kurosawa +1 more | 2008-07-29 |
| 7401983 | Method for manufacturing optical coupling part and optical coupling part | Wataru Sakurai, Kazuhito Saito, Hideo Numata, Hideto Furuyama, Hiroshi Hamasaki | 2008-07-22 |
| 7364369 | Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part | Wataru Sakurai, Kazuhito Saito, Hideo Numata, Hideto Furuyama, Hiroshi Hamasaki | 2008-04-29 |
| 7352052 | Semiconductor device and manufacturing method therefor | Takashi Imoto | 2008-04-01 |